公开(公告)号：US20240321729A1

公开(公告)日：2024-09-26

申请号：US18186781

申请日：2023-03-20

Applicant: QUALCOMM Incorporated

Inventor： Abhijeet PAUL ,  Ravi Pramod Kumar VEDULA ,  Yufei WU

IPC: H01L23/522

CPC classification number: H01L23/5227 ,  H01L28/10

Abstract: Disclosed is an integrated circuit (IC) with an inductor formed from redistribution layers (RDLs). An airgap is provided in an interlayer dielectric (ILD) under the bottom most RDL that makes up the inductor. In this way, an inductor with high Q value is achieved. Also, inductor isolation is improved. Thus, circuits may be placed under the inductor resulting is a smaller die.