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公开(公告)号:US11823831B2
公开(公告)日:2023-11-21
申请号:US16422174
申请日:2019-05-24
Applicant: QUALCOMM Incorporated
Inventor: Rui Tang , Chenqian Gan , Zhongning Liu
CPC classification number: H01F27/346 , H01F41/041 , H05K1/165 , H04B1/525
Abstract: A substrate that includes at least one dielectric layer and an inductive coupler formed in the at least one dielectric layer. The inductive coupler includes a first inductor and a second inductor. The first inductor is formed in the at least one dielectric layer. The first inductor is configured to be coupled to a transmitter filter and an antenna. The second inductor is formed in the at least one dielectric layer. The second inductor is configured to be coupled to the transmitter filter and ground. The second inductor is configured to provide a path to ground for a rejected signal having a rejected frequency. The second inductor is configured such that the rejected signal traveling through the second inductor causes the first inductor to generate an induced signal that counteracts a leakage signal traveling through the transmission filter.
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公开(公告)号:US11270951B2
公开(公告)日:2022-03-08
申请号:US16219071
申请日:2018-12-13
Applicant: QUALCOMM Incorporated
Inventor: Rui Tang , Zhongning Liu , Chenqian Gan
IPC: H01L23/552 , H01L23/64 , H01L49/02 , H05K9/00
Abstract: A substrate that includes at least one dielectric layer, a first inductor formed in the at least one dielectric layer, a second inductor formed in the at least one dielectric layer, and a patterned ground layer formed on a metal layer of the substrate. The patterned ground layer is configured to provide electromagnetic (EM) shielding. The patterned ground layer includes a plurality of slots. The plurality of slots may be filled with the at least one dielectric layer. The plurality of slots may include a slot with a rectangular shape, a slot with a polygon shape, a slot with a circular shape, or combinations thereof. The patterned ground layer may include at least one slot that, individually or collectively, has a shape of a spiral.
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