公开(公告)号：US12273095B2

公开(公告)日：2025-04-08

申请号：US17245901

申请日：2021-04-30

Applicant: QUALCOMM Incorporated

Inventor： Kai Liu ,  Rui Tang ,  Changhan Hobie Yun ,  Mario Francisco Velez ,  Jonghae Kim

IPC: H03H3/02 ,  H01P1/203 ,  H03H9/05 ,  H03H9/54

Abstract: Aspects of the disclosure are directed to a bandpass filter including a first, second, third and fourth resonators, wherein the second and third resonators are in parallel, wherein the first resonator includes a first and second terminals, wherein the second resonator includes a second resonator top terminal and a second resonator bottom terminal, wherein the third resonator includes a third resonator top terminal and a third resonator bottom terminal, wherein the fourth resonator includes a third terminal and a fourth terminal; wherein the first terminal is coupled to the second resonator top terminal, wherein the second terminal is coupled to the third resonator top terminal, wherein the third terminal is coupled to the third resonator bottom terminal, wherein the fourth terminal is coupled to the second resonator bottom terminal; a first inductor coupled to the first and third terminals; and a second inductor coupled to the second and fourth terminals.

公开(公告)号：US11121699B2

公开(公告)日：2021-09-14

申请号：US16279902

申请日：2019-02-19

Applicant: QUALCOMM Incorporated

Inventor： Kai Liu ,  Rui Tang ,  Changhan Hobie Yun ,  Mario Francisco Velez ,  Jonghae Kim

IPC: H03H9/54 ,  H03H9/05 ,  H03H3/02 ,  H01P1/203

Abstract: Aspects of the disclosure are directed to a bandpass filter including a first, second, third and fourth resonators, wherein the second and third resonators are in parallel, wherein the first resonator includes a first and second terminals, wherein the second resonator includes a second resonator top terminal and a second resonator bottom terminal, wherein the third resonator includes a third resonator top terminal and a third resonator bottom terminal, wherein the fourth resonator includes a third terminal and a fourth terminal; wherein the first terminal is coupled to the second resonator top terminal, wherein the second terminal is coupled to the third resonator top terminal, wherein the third terminal is coupled to the third resonator bottom terminal, wherein the fourth terminal is coupled to the second resonator bottom terminal; a first inductor coupled to the first and third terminals; and a second inductor coupled to the second and fourth terminals.

公开(公告)号：US20190081612A1

公开(公告)日：2019-03-14

申请号：US15699984

申请日：2017-09-08

Applicant: Qualcomm Incorporated

Inventor： Rui Tang ,  Antonino Scuderi

IPC: H03H9/54 ,  H03H9/05 ,  H03H1/00

Abstract: An apparatus is disclosed for signal filtering using magnetic coupling. The apparatus includes a substrate having an interface disposed on a surface of the substrate. The interface includes multiple connectors and is configured to accept a filter die that includes an acoustic resonator network. The apparatus also includes multiple inductors that are supported by the substrate. The multiple inductors are connected to the multiple connectors of the interface and are configured to generate a mutual inductance based on individual inductors of the multiple inductors.

公开(公告)号：US11823831B2

公开(公告)日：2023-11-21

申请号：US16422174

申请日：2019-05-24

Applicant: QUALCOMM Incorporated

Inventor： Rui Tang ,  Chenqian Gan ,  Zhongning Liu

IPC: H01F27/34 ,  H01F41/04 ,  H05K1/16 ,  H04B1/525

CPC classification number: H01F27/346 ,  H01F41/041 ,  H05K1/165 ,  H04B1/525

Abstract: A substrate that includes at least one dielectric layer and an inductive coupler formed in the at least one dielectric layer. The inductive coupler includes a first inductor and a second inductor. The first inductor is formed in the at least one dielectric layer. The first inductor is configured to be coupled to a transmitter filter and an antenna. The second inductor is formed in the at least one dielectric layer. The second inductor is configured to be coupled to the transmitter filter and ground. The second inductor is configured to provide a path to ground for a rejected signal having a rejected frequency. The second inductor is configured such that the rejected signal traveling through the second inductor causes the first inductor to generate an induced signal that counteracts a leakage signal traveling through the transmission filter.

公开(公告)号：US11270951B2

公开(公告)日：2022-03-08

申请号：US16219071

申请日：2018-12-13

Applicant: QUALCOMM Incorporated

Inventor： Rui Tang ,  Zhongning Liu ,  Chenqian Gan

IPC: H01L23/552 ,  H01L23/64 ,  H01L49/02 ,  H05K9/00

Abstract: A substrate that includes at least one dielectric layer, a first inductor formed in the at least one dielectric layer, a second inductor formed in the at least one dielectric layer, and a patterned ground layer formed on a metal layer of the substrate. The patterned ground layer is configured to provide electromagnetic (EM) shielding. The patterned ground layer includes a plurality of slots. The plurality of slots may be filled with the at least one dielectric layer. The plurality of slots may include a slot with a rectangular shape, a slot with a polygon shape, a slot with a circular shape, or combinations thereof. The patterned ground layer may include at least one slot that, individually or collectively, has a shape of a spiral.

公开(公告)号：US10749499B2

公开(公告)日：2020-08-18

申请号：US16115397

申请日：2018-08-28

Applicant: QUALCOMM Incorporated

Inventor： Kai Liu ,  Rui Tang

IPC: H03H9/54 ,  H03H9/05 ,  H03H9/10 ,  H03H3/02 ,  H03H9/64 ,  H03H3/08 ,  H01Q1/50 ,  H01F27/28

Abstract: A wideband filter includes a passive substrate and an acoustic resonator chip on the passive substrate. The wideband filter further includes a pair of 3D inductors and a 3D transformer on the passive substrate. The pair of 3D inductors and the 3D transformer are connected to the acoustic resonator chip.