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公开(公告)号:US20190354743A1
公开(公告)日:2019-11-21
申请号:US15980446
申请日:2018-05-15
Applicant: QUALCOMM Incorporated
Inventor: Ashish HINGER , David William Burns , Bo-Ren WANG , Firas SAMMOURA , Sameer WADHWA , Lennart MATHE , Farhad TAGHIBAKHSH
IPC: G06K9/00
Abstract: An apparatus and method for efficiently increasing the signal-to-noise ratio of a biometric sampling system by implementing differential-sampling in successive differential-sampling operations and processing the output of the successive differential-sampling operations to create a biometric image. In some cases, the biometric image may be further noise-reduced by subtracting foreground-off and background-off data.
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公开(公告)号:US20200147643A1
公开(公告)日:2020-05-14
申请号:US16738530
申请日:2020-01-09
Applicant: Qualcomm Incorporated
Inventor: Firas SAMMOURA , David William BURNS , Ravindra Vaman SHENOY
IPC: B06B1/06 , G06K9/00 , G06F3/041 , G06F1/3234 , G06F3/043
Abstract: Implementations of the subject matter described herein relate to sensors including piezoelectric micromechanical ultrasonic transducer (PMUT) sensor elements and arrays thereof. The PMUT sensor elements may be switchable between a non-ultrasonic force detection mode and an ultrasonic imaging mode. A PMUT sensor element may include a diaphragm that is capable of a static displacement on application of a force and is capable of a dynamic displacement when the PMUT sensor element transmits or receives ultrasonic signals. In some implementations, a PMUT sensor element includes a two dimensional-electron gas structure on the diaphragm. The sensors may further include a sensor controller configured to switch between a non-ultrasonic force detection mode and an ultrasonic imaging mode for one or more of the PMUT sensor elements, wherein an applied force is measured in the non-ultrasonic force detection mode and wherein an object is imaged ultrasonically during the ultrasonic imaging mode.
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公开(公告)号:US20170343346A1
公开(公告)日:2017-11-30
申请号:US15169503
申请日:2016-05-31
Applicant: QUALCOMM Incorporated
Inventor: Firas SAMMOURA , Stephanie FUNG , Donald William KIDWELL, JR. , Ravindra Vaman SHENOY , David William BURNS
IPC: G01C9/20 , G01F23/296
CPC classification number: G01C9/20 , G01C9/18 , G01F23/2965
Abstract: A device may include a surface at least partially defining an enclosed region, a plurality of fluids within the enclosed region, the plurality of fluids comprising at least a first fluid having a first acoustic impedance and a second fluid having a second acoustic impedance different from the first acoustic impedance, a first piezoelectric transducer disposed on the surface, the first piezoelectric transducer being configured to generate a first wave reception signal based, at least in part, on an ultrasonic return wave received through at least one of the plurality of fluids, and a processor coupled to the first piezoelectric transducer and configured to determine a measurement of a tilt of the device based, at least in part, on the first wave reception signal.
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公开(公告)号:US20250037498A1
公开(公告)日:2025-01-30
申请号:US18919355
申请日:2024-10-17
Applicant: QUALCOMM Incorporated
Inventor: Hrishikesh Vijaykumar PANCHAWAGH , Ila Ravindra BADGE , Yipeng LU , Kostadin Dimitrov DJORDJEV , Suryaprakash GANTI , Chin-Jen TSENG , Nicholas BUCHAN , Tsongming KAO , Leonard Eugene FENNELL , Firas SAMMOURA , Jessica Liu STROHMANN , David William BURNS
Abstract: Disclosed are methods, devices, apparatuses, and systems for an under-display ultrasonic fingerprint sensor. A display device may include a platen, a display underlying the platen, and an ultrasonic fingerprint sensor underlying the display, where the ultrasonic fingerprint sensor is configured to transmit and receive ultrasonic waves via an acoustic path through the platen and the display. A light-blocking layer and/or an electrical shielding layer may be provided between the ultrasonic fingerprint sensor and the display, where the light-blocking layer and/or the electrical shielding layer are in the acoustic path. A mechanical stress isolation layer may be provided between the ultrasonic fingerprint sensor and the display, where the mechanical stress isolation layer is in the acoustic path.
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