公开(公告)号：US20240385663A1

公开(公告)日：2024-11-21

申请号：US18480955

申请日：2023-10-04

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Huan-Shu CHIEN

IPC: G06F1/20 ,  H05K7/20

Abstract: A pump module for a coolant distribution unit for cooling a heat-generating component is disclosed. A manifold unit has a supply connector to supply coolant to the heat-generating component and a collection connector to collect coolant from a heat exchanger. A first replaceable pump circulates coolant and includes an inlet connector having a valve powered by a first motor. An outlet connector has a valve powered by a second motor. The first pump has an input to activate the motors to move the valves between an open position allowing coolant flow and a closed position. A second pump has an inlet and an outlet coupled to the manifold. The second pump circulates coolant from the inlet to the outlet. The first pump may be disconnected from the manifold unit by activating the motors to close the valves, while the second pump continues to circulate coolant through the manifold unit.

公开(公告)号：US20240349450A1

公开(公告)日：2024-10-17

申请号：US18447704

申请日：2023-08-10

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Huan-Shu CHIEN

IPC: H05K7/20

CPC classification number: H05K7/20272 ,  H05K7/20254

Abstract: A rotatable joint for use in a liquid cooling system comprises a main body and at least one housing portion. The main body has a main body passageway defined therethrough. The at least one housing portion is rotatably coupled to the main body and has a housing portion passageway defined therethrough that is fluidly coupled to the main body passageway. The main body is rotatable between a first position and a second position relative to the at least one housing portion. The main body passageway is fluidly coupled to the housing portion passageway when the main body is in either of the first position and the second position.

公开(公告)号：US20240196565A1

公开(公告)日：2024-06-13

申请号：US18192317

申请日：2023-03-29

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Kuo-Wei LEE ,  Huan-Shu CHIEN

IPC: H05K7/20

CPC classification number: H05K7/20272 ,  H05K7/20772

Abstract: A cooling distribution system cools an electronic computing device and includes a plurality of hot-swappable pump modules mounted within a distribution unit chassis and configured to circulate a coolant along a main cooling path. A coolant inlet manifold is mounted within the chassis and is fluidly coupled to the pump modules to allow entry of the coolant into the main cooling path. A coolant collection pan collects leaked coolant from the coolant circulating along the main cooling path. A recycle pump is fluidly coupled to form a recycle cooling path between the collection pan and the inlet manifold, and is configured to pump the leaked coolant from the collection pan back to the inlet manifold for recirculating the leaked coolant into the main cooling path.

公开(公告)号：US20220346271A1

公开(公告)日：2022-10-27

申请号：US17444802

申请日：2021-08-10

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Huan-Shu CHIEN

IPC: H05K7/20

Abstract: A coolant distribution unit providing reliant circulation of coolant in a liquid cooling system for a heat-generating component such as a computer server is disclosed. The coolant distribution unit includes a manifold unit having a supply connector to supply coolant to the heat-generating component and a collection connector to collect coolant from a heat exchanger. A first pump has an inlet coupled to the manifold unit and an outlet coupled to the manifold unit. The first pump circulates coolant from the inlet to the outlet. A second pump has an inlet coupled to the manifold unit and an outlet coupled to the manifold. The second pump circulates coolant from the inlet to the outlet. The second pump may be disconnected from the manifold unit, while the first pump continues to circulate coolant through the manifold unit.