公开(公告)号：US11540420B2

公开(公告)日：2022-12-27

申请号：US17186509

申请日：2021-02-26

Applicant: QUANTA COMPUTER INC.

Inventor： Jen-Mao Chen ,  Shao-Yu Chen ,  Sin-Hong Lien

IPC: H05K7/20 ,  H05K1/02

Abstract: Embodiments of the disclosure relate to active cooling devices for cooling an electronic assembly positioned downstream in a computing system. In one embodiment, an electronic assembly positioned downstream of the computing system is disclosed. The electronic assembly includes a printed circuit board electrically connected to the computing system; an air duct disposed over the printed circuit board; and an active cooling device thermally coupled to the printed circuit board. The printed circuit board includes a transceiver socket configured to receive at least one optical transceiver and one or more heat-generating components disposed thereon. The at least one optical transceiver is configured to mate with an active optical cable.

公开(公告)号：US11991867B2

公开(公告)日：2024-05-21

申请号：US17445239

申请日：2021-08-17

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung Chen ,  Yu-Nien Huang ,  Jen-Mao Chen ,  Shao-Yu Chen

IPC: H05K7/20

CPC classification number: H05K7/20781 ,  H05K7/20254 ,  H05K7/20272

Abstract: A closed-loop liquid cooling system includes a liquid coolant conduit, a cold plate, a pump and a heat exchanger. The liquid coolant conduit is in proximity to a heat-generating electrical component. The liquid coolant conduit allows circulation of a liquid coolant to extract heat therefrom. The liquid coolant conduit includes an inner portion that surrounds and contains the liquid coolant, and an outer portion configured to prevent or inhibit leakage of the liquid coolant from the inner portion and also detect any leakage from the inner portion. The cold plate is in thermal communication with the liquid coolant. The pump is configured to transport the liquid coolant in the liquid coolant conduit. The heat exchanger is coupled to the liquid coolant conduit to extract heat therefrom.