公开(公告)号：US10209748B2

公开(公告)日：2019-02-19

申请号：US15675980

申请日：2017-08-14

Applicant: Quanta Computer Inc.

Inventor： Yun-Jeng Lin

IPC: G06F1/20 ,  G06F1/16 ,  G06F1/18

Abstract: An electronic device with a heat-dissipation structure includes a host, a first heat-dissipation tube, a display, a rotation joint, and a second heat-dissipation tube. The first heat-dissipation tube is disposed in the host. The display is pivoted on the host. The display is rotated relative to the host about a rotation axis. The rotation joint is connected to the first heat-dissipation tube. The second heat-dissipation tube is disposed in the display, and connected to the rotation joint. A cooling liquid is filled in the first heat-dissipation tube.

公开(公告)号：US10264708B2

公开(公告)日：2019-04-16

申请号：US15652751

申请日：2017-07-18

Applicant: Quanta Computer Inc.

Inventor： Yun-Jeng Lin

IPC: G06F1/20 ,  H05K7/20 ,  H01L23/427

Abstract: An electronic device includes a chassis, a heat source, a thermal diffusion plate, at least one heat pipe and a partition plate. The thermal diffusion plate is thermally connected to the heat source. The heat pipe includes a first end portion and a second end portion. The first end portion is fixedly connected to the thermal diffusion plate. The partition plate is arranged between the chassis and the heat pipe, and is thermally connected to the chassis and the heat pipe. The heat pipe is completely separated from the chassis.

公开(公告)号：US20180317343A1

公开(公告)日：2018-11-01

申请号：US15652751

申请日：2017-07-18

Applicant: Quanta Computer Inc.

Inventor： Yun-Jeng Lin

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20336 ,  G06F1/203 ,  H05K7/20509

Abstract: An electronic device includes a chassis, a heat source, a thermal diffusion plate, at least one heat pipe and a partition plate. The thermal diffusion plate is thermally connected to the heat source. The heat pipe includes a first end portion and a second end portion. The first end portion is fixedly connected to the thermal diffusion plate. The partition plate is arranged between the chassis and the heat pipe, and is thermally connected to the chassis and the heat pipe. The heat pipe is completely separated from the chassis.