公开(公告)号：US10939581B1

公开(公告)日：2021-03-02

申请号：US16858113

申请日：2020-04-24

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung Chen ,  Yu-Nien Huang ,  Yung-Hsiang Lu

IPC: H05K7/20

Abstract: An immersion liquid cooling tank rack for heat-generating components includes immersion liquid cooling tanks for containing a coolant liquid. Horizontal extendable slide rails are mounted on opposing side faces of each tank and on opposing side walls of the rack. The horizontal extendable slide rails are movable between a closed position and an extended open position to allow the tanks to slide horizontally in and out of the rack. Support structures are mounted to the base of each of the immersion liquid cooling tanks. Each support structure includes a wheel assembly disposed at the base of the support structure. The support structures extend from the base of the tank to a floor surface supporting the rack. The horizontal extendable slide rails and the support structures substantially support an operational immersion liquid cooling tank during a horizontal translation of the tank between the closed position and the extended open position.

公开(公告)号：US11219142B2

公开(公告)日：2022-01-04

申请号：US16856804

申请日：2020-04-23

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung Chen ,  Yu-Nien Huang ,  Yung-Hsiang Lu

IPC: H05K7/20

Abstract: An equipment assembly that allows easier replacement of heat-generating electrical components is disclosed. The assembly includes a rack for containing a heat-generating electrical component. The component includes a coolant inlet, a coolant outlet, and a drain connector. A cold manifold supplies coolant to the heat-generating electrical component through the coolant inlet. A hot manifold collects coolant from the heat-generating electrical component through the coolant outlet. A drain manifold includes a coupler. The coolant inlet and the coolant outlet are disconnected from the cold and hot manifolds. The drain connector is fluidly connected to the drain manifold to drain coolant from the heat-generating electrical component before the heat-generating electrical component is removed from the rack.

公开(公告)号：US11102909B2

公开(公告)日：2021-08-24

申请号：US15939690

申请日：2018-03-29

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung Chen ,  Yu-Nien Huang ,  Herman Tan ,  Yung-Hsiang Lu

IPC: H05K5/00 ,  H05K7/20 ,  H05F1/00

Abstract: An air duct that can be attached to existing grille of an electronic device to improve airflow and reduce overall system impedance/pressure drop without increasing the power to an air mover. The air duct has a wall configuration to smooth-out airflow while simultaneously delivering more airflow to selected portions of the interior of an electronic device, such as a server.