公开(公告)号：US20240008218A1

公开(公告)日：2024-01-04

申请号：US17902029

申请日：2022-09-02

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yu-Nien Huang ,  Herman Tan ,  Tien-Juei Chuang

IPC: H05K7/20

CPC classification number: H05K7/20254 ,  H05K7/20263 ,  H05K7/20272 ,  H05K7/20281 ,  H05K7/20136 ,  H05K7/20763 ,  H05K7/20354 ,  H05K7/20318

Abstract: A hybrid cooling system is disclosed that combines a liquid coolant cycle and a refrigerant cycle to efficiently and effectively transfer heat away from a heat-generating component of a computing device. The liquid coolant cycle pumps a liquid coolant through a cold plate to extract heat from the heat-generating component. The heated liquid coolant passes through a coolant-to-refrigerant heat exchanger, where refrigerant from the refrigerant cycle absorbs the heat from the liquid coolant. The heated refrigerant passes through a compressor to a condenser, where the high-pressure, heated refrigerant is cooled by air passing over the condenser. The hybrid cooling system enables cooling of a heat-generating component better than by non-hybrid cooling systems.

公开(公告)号：US11882672B2

公开(公告)日：2024-01-23

申请号：US17204528

申请日：2021-03-17

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung Chen ,  Yu-Nien Huang ,  Herman Tan

IPC: F16L19/02 ,  H05K7/20 ,  H01R13/11 ,  F28F3/12

CPC classification number: H05K7/20327 ,  F16L19/0206 ,  F28F3/12 ,  H01R13/11 ,  H05K7/20254

Abstract: A device for a computing system is disclosed. The device includes a body, a socket, and a connector. The body includes a panel and an internal conduit. The connector extends from the panel. The connector is removably coupled to the socket. The connector includes an outer end and an inner end. The connector also includes a nut that has an exterior surface mating with a corresponding interior surface of the socket, and a tubular inlet. The connector also has a sleeve with an internal bore and an external surface abutting the tubular inlet of the nut. The internal conduit is coupled to the inner end of the connector to circulate cooling liquid through the body. The nut includes an angled portion and the sleeve includes a flared portion for assisting in securing the nut and the sleeve in the internal conduit.

公开(公告)号：US20250040081A1

公开(公告)日：2025-01-30

申请号：US18471206

申请日：2023-09-20

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung Chen ,  Yu-Nien Huang ,  Herman Tan

IPC: H05K7/20

Abstract: An information technology (IT) system is directed to immersion cooling and includes a chassis forming an enclosure between an upstream side and a downstream side. The chassis has a rear opening formed along the downstream side and is configured to receive heat-generating components of the IT system adjacent to the upstream side within the enclosure. The system further includes a supply conduit for delivering an immersion coolant to the upstream side within the enclosure, and a flap mechanism attached to the downstream side near the rear opening. The flap mechanism is movable between an open position and a closed position, which allows accumulated coolant to drain from the chassis in the open position and prevents the accumulated coolant from draining from the chassis in the closed position.

公开(公告)号：US11102909B2

公开(公告)日：2021-08-24

申请号：US15939690

申请日：2018-03-29

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung Chen ,  Yu-Nien Huang ,  Herman Tan ,  Yung-Hsiang Lu

IPC: H05K5/00 ,  H05K7/20 ,  H05F1/00

Abstract: An air duct that can be attached to existing grille of an electronic device to improve airflow and reduce overall system impedance/pressure drop without increasing the power to an air mover. The air duct has a wall configuration to smooth-out airflow while simultaneously delivering more airflow to selected portions of the interior of an electronic device, such as a server.

公开(公告)号：US12120842B2

公开(公告)日：2024-10-15

申请号：US17829869

申请日：2022-06-01

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung Chen ,  Herman Tan ,  Tien-Juei Chuang ,  Chieh-Ling Chang

IPC: H05K7/20

CPC classification number: H05K7/20145 ,  H05K7/20209

Abstract: An air duct is disclosed. The air duct includes a housing for directing air over a plurality of slots within a computer system. The housing includes side housing walls and a top housing wall. The side housing walls are respectively connected to opposing ends of the top housing wall. The side housing walls extend in the same direction from the top housing wall. The air duct further includes a plurality of fins extending from the top housing wall in the same direction as the side housing walls. Each fin of the plurality of fins is arranged on the top housing wall so as to be positioned between adjacent slots of the plurality of slots when the housing is located within the computer system.

公开(公告)号：US11927202B2

公开(公告)日：2024-03-12

申请号：US16947526

申请日：2020-08-05

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung Chen ,  Yu-Nien Huang ,  Herman Tan

IPC: F04D29/70 ,  F04D19/00 ,  F04D29/32 ,  F04D29/52

CPC classification number: F04D29/703 ,  F04D19/002 ,  F04D29/325 ,  F04D29/522

Abstract: A fan guard for a fan container includes a housing and a plurality of wings. The housing has a hollow interior defined by a cylindrical inner surface. The housing extends longitudinally between a first housing end and a second housing end. The plurality of wings is positioned within the hollow interior of the housing. Each wing of the plurality of wings extends radially, from a center of symmetry of the cylindrical inner surface to the cylindrical inner surface. Each wing of the plurality of wings is radially curved between the first housing end and the second housing end.

公开(公告)号：US11877424B2

公开(公告)日：2024-01-16

申请号：US17825433

申请日：2022-05-26

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung Chen ,  Yu-Nien Huang ,  Herman Tan ,  Tien-Juei Chuang

IPC: H05K7/20

CPC classification number: H05K7/20336 ,  H05K7/20509

Abstract: A cold plate for cooling an electronic component is disclosed. The cold plate includes a base portion having a fluid channel with a fluid inlet and a fluid outlet, the fluid channel being configured to internally circulate a cooling fluid for carrying heat dissipated by the electrical component; and a cover coupled to the base portion such that the fluid channel is enclosed internally in the cold plate. The cover has a vapor outlet formed on a top side of the cover, the vapor outlet allowing generated vapor to exit from within the cold plate. Also disclosed is a method for cooling the electronic component via the cold plate. The method includes allowing some fluid of the circulating cooling fluid to seep from the fluid channel into an internal chamber, and allowing vapor to be expelled through the vapor outlet.

公开(公告)号：US11874712B2

公开(公告)日：2024-01-16

申请号：US17647042

申请日：2022-01-05

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung Chen ,  Herman Tan ,  Tien-Juei Chuang

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/20 ,  H05K7/20727

Abstract: According to certain aspects of the present disclosure, a system includes a heat-generating component and a thermal wake suppressor positioned downstream from the heat-generating component. The heat-generating component produces a thermal wake in a downstream direction. The thermal wake suppressor includes a spacing grid and a plurality of twist plates extending from the spacing grid at an angle. The spacing grid is defined by a plurality of longitudinal ribs and a plurality of transverse ribs that form a plurality of intersections. The plurality of twist plates is periodically arranged on the plurality of longitudinal ribs and the plurality of transverse ribs, such that a subset of the plurality of twist plates is arranged to break apart the thermal wake into sub-vortexes in the downstream direction.

公开(公告)号：US20250040101A1

公开(公告)日：2025-01-30

申请号：US18473199

申请日：2023-09-22

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Yu-Nien Huang ,  Herman Tan

IPC: H05K7/20

Abstract: A hybrid cooling system is configured to receive heat-generating components of an information technology (IT) device. The system includes a chassis having a peripheral wall that extends between a chassis base and an open top surface, the peripheral wall forming an enclosure between an upstream side and a downstream side. An immersion conduit delivers an immersion coolant and fills the enclosure to fully immerse the heat-generating components. An outlet duct drain overflow of the immersion coolant accumulated in the enclosure. A cold plate within the enclosure is configured for direct contact with at least one heat-generating component. A supply conduit delivers a direct coolant in cooled form within the cold plate, and is in flow communication with a cold plate inlet connector. A return conduit removes the direct coolant in heated form from the cold plate, and is in flow communication with a cold plate outlet connector.

公开(公告)号：US12144151B2

公开(公告)日：2024-11-12

申请号：US17725053

申请日：2022-04-20

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung Chen ,  Yu-Nien Huang ,  Herman Tan ,  Tien-Juei Chuang

IPC: H05K7/20

Abstract: A fluid cooling system includes a boiling plate, a compressor, and a condenser. The boiling plate contacts a heat-generating electronic component. The boiling plate receives a liquid such that the liquid absorbs heat from the electronic component and evaporates into a vapor. The compressor is fluidly connected the boiling plate and receives the vapor of the boiling plate. The compressor increases the pressure of the vapor such that the temperature of the vapor increases, and such that a saturation temperature of the vapor increases. The condenser is fluidly connected to the compressor and the boiling plate. The condenser receives the vapor from the compressor and removes heat from the vapor such that the vapor condenses back into the liquid. The boiling plate receives the liquid from the condenser. The system can include a pump that circulates the liquid and the vapor between the boiling plate, the compressor, and the condenser.