公开(公告)号：US3678995A

公开(公告)日：1972-07-25

申请号：US3678995D

申请日：1970-06-22

Applicant: RCA CORP

Inventor： COLLARD JACQUES ROGER

IPC: H01B3/00 ,  H01C17/06 ,  H01L23/36 ,  H01L23/373 ,  H01L1/12

CPC classification number: H01B3/004 ,  H01C17/06 ,  H01L23/36 ,  H01L23/3732 ,  H01L2924/0002 ,  Y10S228/903 ,  Y10T428/12486 ,  Y10T428/12625 ,  H01L2924/00

Abstract: A heat conducting support on which an electrical component can be mounted so as to conduct heat generated by the component away from the component. The support includes a substrate of good heat conducting material and a diamond body embedded in the substrate with a surface of the diamond body being flush with a surface of the substrate. A metal film extends over the surface of the substrate and the diamond body and is strongly adhered to the substrate. An electrical component can be mounted on and secured to the metal film over the diamond body. The support is formed by placing the diamond body on the surface of a plate of the material of the substrate and coating the surface of the plate around the diamond body with additional material of the substrate. The coating contacts the peripheral edge of the diamond body to secure the diamond body to the substrate and extends to the surface of the diamond body. A metal film can then be deposited on the surface of the diamond body and the coating.

Abstract translation: 导热支撑件，其上可以安装电气部件，以便将由部件产生的热量远离部件。 支撑体包括良好导热材料的基底和嵌入基底中的金刚石体，金刚石体的表面与基底的表面齐平。 金属膜在基板和金刚石主体的表面上延伸并且牢固地附着在基板上。 电气部件可以安装在金刚石主体上并固定到金属膜上。 通过将金刚石主体放置在基板的材料的板的表面上并且用基板的附加材料涂覆在金刚石主体周围的表面上来形成支撑件。 涂层接触金刚石体的周边边缘，以将金刚石体固定在基体上并延伸到金刚石体的表面。 然后可以在金刚石体和涂层的表面上沉积金属膜。

公开(公告)号：US3665254A

公开(公告)日：1972-05-23

申请号：US3665254D

申请日：1970-10-12

Applicant: RCA CORP

Inventor： COLLARD JACQUES ROGER ,  NARAYAN SUBRAHMANYAM YEGNA ,  PACZKOWSKI JOHN PAUL

IPC: H01L23/488 ,  H01L29/00 ,  H01L3/00 ,  H01L5/00

CPC classification number: H01L24/01 ,  H01L23/488 ,  H01L29/00 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12032 ,  H01L2924/12043 ,  H01L2924/00

Abstract: A Schottky surface barrier junction diode in which a metal layer is provided over a surface of a body of semiconductor material. The metal layer has a first portion which is in contact with the surface of the body to form the Schottky surface barrier junction, and a second portion which is spaced from the surface of the body. A bonding layer is provided between the second portion of the metal layer and the surface of the body and mechanically secures the metal layer to the body. A terminal lead is in contact with the metal layer and is bonded only to the second portion of the metal layer so that the terminal lead is mechanically secured to the body without disrupting the Schottky surface barrier junction.