公开(公告)号：US3665256A

公开(公告)日：1972-05-23

申请号：US3665256D

申请日：1968-10-15

Applicant: RCA CORP

Inventor： GOUN NATHAN M ,  WHEATELY CARL F JR

IPC: H01L21/56 ,  H01L23/495 ,  H05K1/02 ,  H01L1/12

CPC classification number: H05K1/0203 ,  H01L21/565 ,  H01L23/49568 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/181 ,  H05K2201/10659 ,  H05K2201/10689 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An integrated circuit chip having circuit elements capable of relatively high power operation is encapsulated in a body of polymeric material having the form of an elongated rectangular prism. Conductors are electrically coupled to the elements in the integrated circuit chip and extend outwardly of the body of polymeric material through its relatively long sides. Heat conductors thermally coupled to the integrated circuit chip extend outwardly of the package through the same sides as the electrical conductors and are adapted to couple the integrated circuit chip to an external heat dispersing means.