公开(公告)号：US20250164652A1

公开(公告)日：2025-05-22

申请号：US18943129

申请日：2024-11-11

Applicant: REDLEN TECHNOLOGIES, INC.

Inventor： Eric KYFIUK ,  Michael AYUKAWA ,  Bernard HARRIS ,  Krzysztof INIEWSKI

IPC: G01T1/24 ,  A61B6/42

Abstract: A detector structure includes a supporting substrate having an opening therethrough that is laterally surrounded on all sides by the supporting substrate, a carrier board located over a front side of the supporting substrate, the carrier board including interconnect structures electrically extending between the front side and a back side of the carrier board; at least one SIC located over the carrier board, the at least one ASIC including signal processing channel circuitry, at least one radiation sensor located over a front side of the at least one ASIC, and a connector located within the opening in the supporting substrate, the connector is electrically coupled to the interconnect structures on the back side of the carrier board. Further embodiments include detector modules including a plurality of above-described detector structures, a module circuit board coupled to the connectors by cables, and a heat sink.