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    RADIATION DETECTOR CONTAINING A CONNECTOR LOCATED WITHIN AN OPENING IN A SUPPORTING SUBSTRATE
    1.
    发明申请
    RADIATION DETECTOR CONTAINING A CONNECTOR LOCATED WITHIN AN OPENING IN A SUPPORTING SUBSTRATE 有权

    公开(公告)号：US20250164652A1

    公开(公告)日：2025-05-22

    申请号：US18943129

    申请日：2024-11-11

    Applicant: REDLEN TECHNOLOGIES, INC.

    Inventor： Eric KYFIUK ,  Michael AYUKAWA ,  Bernard HARRIS ,  Krzysztof INIEWSKI

    IPC: G01T1/24 ,  A61B6/42

    Abstract: A detector structure includes a supporting substrate having an opening therethrough that is laterally surrounded on all sides by the supporting substrate, a carrier board located over a front side of the supporting substrate, the carrier board including interconnect structures electrically extending between the front side and a back side of the carrier board; at least one SIC located over the carrier board, the at least one ASIC including signal processing channel circuitry, at least one radiation sensor located over a front side of the at least one ASIC, and a connector located within the opening in the supporting substrate, the connector is electrically coupled to the interconnect structures on the back side of the carrier board. Further embodiments include detector modules including a plurality of above-described detector structures, a module circuit board coupled to the connectors by cables, and a heat sink.

    RADIATION DETECTOR MODULE WITH LOCAL PROCESSING UNIT
    2.
    发明公开
    RADIATION DETECTOR MODULE WITH LOCAL PROCESSING UNIT 审中-公开

    公开(公告)号：US20240085577A1

    公开(公告)日：2024-03-14

    申请号：US18462859

    申请日：2023-09-07

    Applicant: REDLEN TECHNOLOGIES, INC.

    Inventor： Michael AYUKAWA ,  James FUJIMOTO ,  Krzysztof INIEWSKI

    IPC: G01T1/24 ,  G06F15/78

    CPC classification number: G01T1/243 ,  G01T1/247 ,  G06F15/7807

    Abstract: An X-ray detector module of a multi-module X-ray detector array having a local processing unit configured to provide real-time control and computational capabilities at the x-ray detector module. In various embodiments, by providing these capabilities in the detector module itself, as opposed to a component located downstream of the detector module, there may be an immediate cost reduction, opportunities to include additional features, and performance improvement opportunities not otherwise practical to implement in conventional X-ray imaging systems.

    SYSTEMS AND METHODS FOR X-RAY DIFFRACTION VIRTUAL SPECTROSCOPY
    4.
    发明申请
    SYSTEMS AND METHODS FOR X-RAY DIFFRACTION VIRTUAL SPECTROSCOPY 审中-公开

    公开(公告)号：US20200326290A1

    公开(公告)日：2020-10-15

    申请号：US16844484

    申请日：2020-04-09

    Applicant: REDLEN TECHNOLOGIES, INC.

    Inventor： Krzysztof INIEWSKI ,  Michael AYUKAWA ,  Conny HANSSON

    IPC: G01N23/20008 ,  G01N23/207

    Abstract: Various aspects include methods and devices for reducing the scanning time for an X-ray diffraction scanner system by increasing the count rate or efficiency of the energy discriminating X-ray detector. In a first embodiment, the count rate of the energy discriminating X-ray detector is increased by increasing the number of detectors counting X-ray scatter photon in particular energy bins by configuring individual pixel detectors within a 2-D X-ray detector array to count photons within specific energy bins. In a second embodiment, the gain of amplifier components in the detector processing circuitry is increased in order to increase the energy resolution of the detector. In a third embodiment, the individual pixel detectors within a 2-D X-ray detector array are configured to count photons within specific energy bins and the gain of amplifier components in the detector processing circuitry is increased in order to increase the energy resolution of the detector.

    RADIATION DETECTOR MODULE INCLUDING APPLICATION SPECIFIC INTEGRATED CIRCUIT WITH THROUGH-SUBSTRATE VIAS
    7.
    发明公开
    RADIATION DETECTOR MODULE INCLUDING APPLICATION SPECIFIC INTEGRATED CIRCUIT WITH THROUGH-SUBSTRATE VIAS 审中-公开

    公开(公告)号：US20240230932A9

    公开(公告)日：2024-07-11

    申请号：US18468891

    申请日：2023-09-18

    Applicant: REDLEN TECHNOLOGIES, INC.

    Inventor： Michael AYUKAWA ,  Krzysztof INIEWSKI

    IPC: G01T1/24 ,  G01T1/175 ,  G01T1/29

    CPC classification number: G01T1/241 ,  G01T1/175 ,  G01T1/243 ,  G01T1/244 ,  G01T1/247 ,  G01T1/2985

    Abstract: A radiation detector unit includes at least one radiation sensor having pixel detectors that generate event detection signals in response to photon interaction events, an application specific integrated circuit (ASIC) including circuit components on a substrate, the at least one radiation sensor mounted over the application specific integrated circuit via a plurality of bonding material portions such that event detection signals generated in each of the pixel detectors of the at least one radiation sensor are received at a respective pixel region of the ASIC, and the circuit components of the ASIC convert the event detection signals received at each of the pixel regions of the ASIC to digital detection signals, and a carrier board underlying the ASIC, where the ASIC includes a plurality of through-substrate vias (TSVs) electrically coupling the ASIC to the carrier board, each of the TSVs underlying an active pixel detector of the at least one radiation sensor.

    RADIATION DETECTOR MODULE INCLUDING APPLICATION SPECIFIC INTEGRATED CIRCUIT WITH THROUGH-SUBSTRATE VIAS
    8.
    发明公开
    RADIATION DETECTOR MODULE INCLUDING APPLICATION SPECIFIC INTEGRATED CIRCUIT WITH THROUGH-SUBSTRATE VIAS 审中-公开

    公开(公告)号：US20240134071A1

    公开(公告)日：2024-04-25

    申请号：US18468891

    申请日：2023-09-17

    Applicant: REDLEN TECHNOLOGIES, INC.

    Inventor： Michael AYUKAWA ,  Krzysztof INIEWSKI

    IPC: G01T1/24 ,  G01T1/175 ,  G01T1/29

    CPC classification number: G01T1/241 ,  G01T1/175 ,  G01T1/243 ,  G01T1/244 ,  G01T1/247 ,  G01T1/2985

    Abstract: A radiation detector unit includes at least one radiation sensor having pixel detectors that generate event detection signals in response to photon interaction events, an application specific integrated circuit (ASIC) including circuit components on a substrate, the at least one radiation sensor mounted over the application specific integrated circuit via a plurality of bonding material portions such that event detection signals generated in each of the pixel detectors of the at least one radiation sensor are received at a respective pixel region of the ASIC, and the circuit components of the ASIC convert the event detection signals received at each of the pixel regions of the ASIC to digital detection signals, and a carrier board underlying the ASIC, where the ASIC includes a plurality of through-substrate vias (TSVs) electrically coupling the ASIC to the carrier board, each of the TSVs underlying an active pixel detector of the at least one radiation sensor.

    DIRECT ATTACH RADIATION DETECTOR STRUCTURES INCLUDING PIXELATED SENSORS AND READ-OUT CIRCUITRY HAVING VARYING PITCH
    10.
    发明申请
    DIRECT ATTACH RADIATION DETECTOR STRUCTURES INCLUDING PIXELATED SENSORS AND READ-OUT CIRCUITRY HAVING VARYING PITCH 有权

    公开(公告)号：US20240377544A1

    公开(公告)日：2024-11-14

    申请号：US18612288

    申请日：2024-03-21

    Applicant: REDLEN TECHNOLOGIES, INC.

    Inventor： Glenn BINDLEY ,  Krzysztof INIEWSKI ,  Michael AYUKAWA

    IPC: G01T1/29 ,  G01T1/24

    Abstract: Direct attach radiation detector structures include an application specific integrated circuit (ASIC) including an array of unit cells including signal processing channel circuitry and at least one radiation sensor including an array of pixel detectors located over a front surface of the ASIC. In various embodiments, an ASIC having a fixed layout of unit cells may accommodate different radiation sensors having varying layouts of pixel detectors. In some embodiments, a redistribution layer on the front surface of the ASIC may route detection signals from pixel detectors to the corresponding unit cells. Alternatively, or in addition, a subset of the unit cells of the ASIC may be active unit cells that are electrically coupled to a pixel detector. The remaining unit cells may be inactive unit cells that may be powered down.

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