公开(公告)号：US20230077602A1

公开(公告)日：2023-03-16

申请号：US17931397

申请日：2022-09-12

Applicant: REDLEN TECHNOLOGIES, INC.

Inventor： Amir AFSHAR ,  Pramodha MARTHANDAM ,  Jennifer JENSEN ,  Michael K. JACKSON ,  James BALCOM

IPC: G01T1/24 ,  H01L27/146 ,  H01L23/544

Abstract: A method of fabricating radiation sensor dies includes forming a plurality of radiation-sensitive detector elements and a plurality of visible identifiers on at least some of the radiation-sensitive detector elements on a substrate, where each visible identifier is located in a different sub-region of the substrate containing a subset of the radiation-sensitive detector elements, and separating the sub-regions of the substrate from one another to provide a plurality of radiation sensor dies, where the visible identifier on each radiation sensor die uniquely identifies the radiation sensor die with respect to the other radiation sensor dies of the plurality of radiation sensor dies.