公开(公告)号：US20210080330A1

公开(公告)日：2021-03-18

申请号：US17009849

申请日：2020-09-02

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Kan TAKEUCHI ,  Yoshio TAKAZAWA ,  Fumio TSUCHIYA ,  Daisuke OSHIDA ,  Naoya OTA ,  Masaki SHIMADA ,  Shinya KONISHI

IPC: G01K1/02 ,  H02P29/68 ,  G01K7/01 ,  G08C17/02

Abstract: A semiconductor device according to an embodiment includes a holding circuit including a buffer configured to obtain a heat stress information having a temperature dependency every predetermined period and a stress counter configured to accumulate the heat stress information and hold the accumulated value as a cumulative stress count value, a control circuit including an operation determination threshold value, and a wireless communication circuit. According to the semiconductor device according to the embodiment, while reducing the power consumption, it is possible to wirelessly transmit the cumulative heat stress information.

公开(公告)号：US20200081757A1

公开(公告)日：2020-03-12

申请号：US16543129

申请日：2019-08-16

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Naoya OTA ,  Kan TAKEUCHI ,  Fumio TSUCHIYA ,  Masaki SHIMADA ,  Shinya KONISHI ,  Daisuke OSHIDA

IPC: G06F11/07

Abstract: The semiconductor device has a module having a predetermined function, an error information acquisition circuit for acquiring error information about an error occurring in the module, a stress acquisition circuit for acquiring a stress accumulated value as an accumulated value of stress applied to the semiconductor device, and an analysis data storage for storing analysis data as data for analyzing the state of the semiconductor device, the error information and the stress accumulated value at the time of occurrence of the error being associated with each other.