Process for bonding copper or iron to titanium or tantalum
    1.
    发明授权
    Process for bonding copper or iron to titanium or tantalum 失效
    将铜或铁连接到钛或钽的方法

    公开(公告)号:US3835007A

    公开(公告)日:1974-09-10

    申请号:US31485872

    申请日:1972-12-13

    Applicant: RHONE PROGIL

    CPC classification number: C23C28/023 C23C14/021

    Abstract: COPPER OR IRON ARE SECURELY BONDED TO TITANIUM OR TANTALUM SUBSTRATE METAL BY INITIALLY SUBJECTING THE SUBSTRATE METAL TO IONIC BOMBARDMENT IN WHICH THE SUBSTRATE METAL PERFORMS THE ROLE OF A CATHODE AND THEN TO CATHODE SPUTTERING IN WHICH THE SUBSTRATE METAL PERFORMS THE ROLE OF AN ANODE, AND THE COPPER OR IRON THE ROLE OF A CATHODE. THEREAFTER, THE BONDED COPPER OR IRON IS SUPPLEMENTED BY ADDITIONAL DEPOSITS BY CONVENTIONAL MEANS SUCH AS ELECTRODEPOSITION, ETC. SUPERIOR INDUSTRIAL PRODUCTS RESULTING FROM THE PROCESS ARE USEFUL AS ANODES IN ELECTROLYSIS CELLS AND AS HEAT EXCHANGERS.

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