MEMS SENSOR, METHOD FOR MANUFACTURING THE SAME, AND MEMS PACKAGE INCLUDING THE SAME
    1.
    发明申请
    MEMS SENSOR, METHOD FOR MANUFACTURING THE SAME, AND MEMS PACKAGE INCLUDING THE SAME 审中-公开
    MEMS传感器,其制造方法和包括其的MEMS封装

    公开(公告)号:US20150331066A1

    公开(公告)日:2015-11-19

    申请号:US14713605

    申请日:2015-05-15

    Applicant: ROHM CO., LTD.

    CPC classification number: G01R33/0286 G01R33/0052 G01R33/07

    Abstract: A MEMS sensor according to the present invention includes a base substrate including a displaceably supported movable portion and a lid substrate covering the movable portion and functioning as a magnetic sensor that detects magnetism by making use of the Hall effect.

    Abstract translation: 根据本发明的MEMS传感器包括基底基板,其包括可移动支撑的可动部分和覆盖可动部分的盖基板,并且用作通过利用霍尔效应来检测磁性的磁传感器。

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