公开(公告)号：US12283540B2

公开(公告)日：2025-04-22

申请号：US18295111

申请日：2023-04-03

Applicant: ROHM CO., LTD.

Inventor： Bin Zhang ,  Akinori Nii ,  Taro Nishioka

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/31

Abstract: There is provided a semiconductor device including: a lead frame including a first opening portion; a resin filled in the first opening portion; and a semiconductor element electrically connected to the lead frame, wherein a side wall surface of the lead frame in the first opening portion has a larger average surface roughness than an upper surface of the lead frame.

公开(公告)号：US11652040B2

公开(公告)日：2023-05-16

申请号：US16867266

申请日：2020-05-05

Applicant: ROHM CO., LTD.

Inventor： Bin Zhang ,  Akinori Nii ,  Taro Nishioka

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/48

CPC classification number: H01L23/49861 ,  H01L21/485 ,  H01L23/3121 ,  H01L23/49866

Abstract: There is provided a semiconductor device including: a lead frame including a first opening portion; a resin filled in the first opening portion; and a semiconductor element electrically connected to the lead frame, wherein a side wall surface of the lead frame in the first opening portion has a larger average surface roughness than an upper surface of the lead frame.

公开(公告)号：US20230080548A1

公开(公告)日：2023-03-16

申请号：US17931256

申请日：2022-09-12

Applicant: ROHM Co., LTD.

Inventor： Shinya Hikita ,  Kenji Fujii ,  Akinori Nii ,  Bin Zhang ,  Hiroaki Aoyama

IPC: H01L23/498 ,  H01L23/06

Abstract: Provided is an electronic apparatus including an electronic part, a resin member that covers the electronic part, and a plurality of leads each electrically connected to the electronic part, the resin member including a first resin side surface facing one side in a first direction orthogonal to a thickness direction of the resin member, the plurality of leads including a plurality of first side exposed portions arranged along the first resin side surface, each of the plurality of first side exposed portions being exposed from the first resin side surface, each of the plurality of first side exposed portions including a first tapered portion becoming narrower toward the first resin side surface as viewed in the thickness direction, the first tapered portion including a first front surface that faces the same direction as the first resin side surface in the first direction and is flush with the first resin side surface.