LAYER DEBONDING
    1.
    发明申请
    LAYER DEBONDING 审中-公开

    公开(公告)号:US20200164626A1

    公开(公告)日:2020-05-28

    申请号:US16690321

    申请日:2019-11-21

    Abstract: A method (1800) of debonding a first layer (404) from a second layer (408), wherein the first layer (404) is bonded to the second layer (408) by an adhesive (410) located between the first and second layers, comprises: inserting (1804) a blade (602) of a cleaving tool (600) between the first and second layers (404, 408); and exerting (1806) a controlled force on the cleaving tool (600) to move the cleaving tool so as to de-bond the first and second layers (404, 408) in a region, wherein the force exerted is controlled to match a de-bonding force calculated for the region, and such that the movement of the cleaving tool (600) stops if the calculated force is less than force required to move the cleaving tool (600) and continued if the calculated force is higher than or equal to the force required to move the cleaving tool.

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