公开(公告)号：US20220270789A1

公开(公告)日：2022-08-25

申请号：US17354057

申请日：2021-06-22

Applicant: Ralec Electronic Corporation

Inventor： Tim WANG ,  Quo-Xiang CHI ,  Chia-Cheng CHENG ,  Wen-Chun CHEN

IPC: H01C1/142 ,  H01C17/00 ,  H01C1/08

Abstract: A chip resistor includes a main body having opposite first and second surfaces and a peripheral surface connected between the first and second surfaces, and first and second electrode units oppositely and separately disposed on the peripheral surface. The main body includes a resistance layer having opposite top and bottom surfaces, a metallic heat dissipation layer disposed on the top surface of the resistance layer, a metallic heat conductive layer disposed on the bottom surface of the resistance layer, and an insulating unit interposed between the resistance layer and the metallic heat dissipation layer, and between the resistance layer and the metallic heat conductive layer.

公开(公告)号：US20210125779A1

公开(公告)日：2021-04-29

申请号：US16794664

申请日：2020-02-19

Applicant: Ralec Electronic Corporation

Inventor： Tim WANG ,  Chia-Cheng CHENG

IPC: H01F41/04 ,  H01F41/076

Abstract: A method for making a thin-film inductor includes the steps of: a) forming an array of coil units from an electrically conductive substrate, b) introducing a magnetic material into mold cavities of a mold unit, c) disposing each of the coil units on the magnetic material in a respective one of the mold cavities, d) introducing additional magnetic material into the mold cavities to completely cover the coil units, e) molding the magnetic material and the coil units in the mold unit to form semi-products, and f) forming, on each of the semi-products, two terminal electrodes and electrically connecting the terminal electrodes to the coil unit so as to obtain the thin-film inductors.