公开(公告)号：US20220270789A1

公开(公告)日：2022-08-25

申请号：US17354057

申请日：2021-06-22

Applicant: Ralec Electronic Corporation

Inventor： Tim WANG ,  Quo-Xiang CHI ,  Chia-Cheng CHENG ,  Wen-Chun CHEN

IPC: H01C1/142 ,  H01C17/00 ,  H01C1/08

Abstract: A chip resistor includes a main body having opposite first and second surfaces and a peripheral surface connected between the first and second surfaces, and first and second electrode units oppositely and separately disposed on the peripheral surface. The main body includes a resistance layer having opposite top and bottom surfaces, a metallic heat dissipation layer disposed on the top surface of the resistance layer, a metallic heat conductive layer disposed on the bottom surface of the resistance layer, and an insulating unit interposed between the resistance layer and the metallic heat dissipation layer, and between the resistance layer and the metallic heat conductive layer.