Pre-metal dielectric rapid thermal processing for sub-micron technology
    1.
    发明授权
    Pre-metal dielectric rapid thermal processing for sub-micron technology 失效
    用于亚微米技术的金属介电快速热处理

    公开(公告)号:US06514876B1

    公开(公告)日:2003-02-04

    申请号:US09644759

    申请日:2000-08-23

    IPC分类号: H01L2144

    摘要: A process for forming silicate glass layers on substrates is disclosed. A silicate glass layer is first deposited onto a substrate, such as a semiconductor wafer. The wafer is then placed in a thermal processing chamber and heated in the presence of a reactive gas. The object is heated to a temperature sufficient for reflow of the silicate glass. In one embodiment, the atmosphere contained within the processing chamber comprises steam in combination with a reactive gas. The reactive gas can be, for instance, hydrogen, oxygen, nitrogen, dinitrogen oxide, ozone, hydrogen peroxide, atomic and/or molecular hydrogen, or radicals or mixtures thereof.

    摘要翻译: 公开了一种在衬底上形成硅酸盐玻璃层的工艺。 首先将硅酸盐玻璃层沉积到诸如半导体晶片的衬底上。 然后将晶片放置在热处理室中并在反应气体存在下加热。 将该物体加热至足以使硅酸玻璃玻璃回流的温度。 在一个实施例中,包含在处理室内的气氛包括与反应气体组合的蒸汽。 反应气体可以是例如氢,氧,氮,二氧化氮,臭氧,过氧化氢,原子和/或分子氢,或其基团或其混合物。