Method of fabricating devices using an attenuated phase-shifting mask and an attenuated phase-shifting mask
    1.
    发明授权
    Method of fabricating devices using an attenuated phase-shifting mask and an attenuated phase-shifting mask 有权
    使用衰减相移掩模和衰减相移掩模制造器件的方法

    公开(公告)号:US06251546B1

    公开(公告)日:2001-06-26

    申请号:US09397716

    申请日:1999-09-16

    IPC分类号: G03F900

    CPC分类号: G03F1/32

    摘要: An improved attenuated phase-shifting mask (APSM) for use with an imaging tool for forming a patterned feature on a photoresist layer of a semiconductor wafer. The APSM has a transmissive region for substantially transmitting light therethrough to form a projected image substantially shaped as the patterned feature on the photoresist layer. The APSM also has an attenuating and phase-shifting region, contiguous with the transmissive region, for absorbing a portion of the light incident thereon and for shifting the phase of the incident light by a predetermined number of degrees relative to that of the light transmitted through the transmissive region so as to destructively interfere with the light transmitted through the transmissive region and to project a background image. The transmissive region has a dimension d dimensioned such that the intensity of the image projected by the transmissive region is darker than the intensity of the background image projected by the attenuating and phase-shifting region of the mask and that the intensity of the background image is substantially uniform.

    摘要翻译: 一种与用于在半导体晶片的光致抗蚀剂层上形成图案化特征的成像工具一起使用的改进的衰减相移掩模(APSM)。 APSM具有用于基本上透射光的透射区域,以形成基本上成形为光致抗蚀剂层上的图案化特征的投影图像。 APSM还具有与透射区域相邻的衰减和相移区域,用于吸收入射到其上的光的一部分,并且将入射光的相位相对于透射的光的相位偏移预定的数量 透射区域,以便破坏性地干扰透过透射区域的光并投影背景图像。 透射区域具有维度d,其尺寸使得由透射区域投射的图像的强度比由掩模的衰减和相移区域投影的背景图像的强度更暗,并且背景图像的强度为 基本均匀。

    Lithographic process having sub-wavelength resolution
    2.
    发明授权
    Lithographic process having sub-wavelength resolution 有权
    具有亚波长分辨率的平版印刷工艺

    公开(公告)号:US06218057B1

    公开(公告)日:2001-04-17

    申请号:US09293103

    申请日:1999-04-16

    IPC分类号: G03F900

    CPC分类号: G03F7/0035

    摘要: A lithographic process for making an article such as a semiconductor device or a lithographic mask is disclosed. In the process, articles are fabricated by a sequence of steps in which materials are deposited on a substrate and patterned. These patterned layers are used to form devices on the semiconductor substrate. The desired pattern is formed by introducing an image of a first pattern in a layer of energy sensitive material. The image is then developed to form a first pattern. A layer of energy sensitive material is then formed over the first pattern. An image of a second pattern is then formed in the layer of energy sensitive material formed over the first pattern. The second pattern is then developed. The desired pattern is then developed from the first pattern and the second pattern.

    摘要翻译: 公开了用于制造诸如半导体器件或光刻掩模的物品的光刻工艺。 在此过程中,通过一系列步骤制造制品,其中将材料沉积在衬底上并图案化。 这些图案化层用于在半导体衬底上形成器件。 通过在第一层能量敏感材料中引入第一图案的图像来形成所需的图案。 然后显影图像以形成第一图案。 然后在第一图案上形成一层能量敏感材料。 然后在形成在第一图案上的能量敏感材料层中形成第二图案的图像。 然后开发第二种模式。 然后从第一图案和第二图案展开期望的图案。

    Process for device fabrication using a variable transmission aperture
    3.
    发明授权
    Process for device fabrication using a variable transmission aperture 有权
    使用可变传输孔径的器件制造工艺

    公开(公告)号:US6015644A

    公开(公告)日:2000-01-18

    申请号:US190351

    申请日:1998-11-12

    IPC分类号: H01L21/027 G03F7/20 G03F9/00

    摘要: A process for device fabrication is disclosed. In the process, optical lithography is used to introduce an image of a desired pattern into an energy sensitive material. In the process, a filter element is provided. The filter element has at least two regions of different transmittance, each region denominated an aperture. The regions are selected by obtaining information about the desired pattern and an optical lithographic tool that will be used to introduce the image of the desired pattern into the energy sensitive resist material. A filter element that provides an image that, when developed, will provide features with dimensions within acceptable process tolerances is then designed. The filter element is designed by modeling the effects of each aperture of the filter element on the intensity profile of an image of the desired pattern. The combined effect of the apertures is then determined. If required, an aspect (transmittance, orientation, dimension) of the one or more of the proposed apertures is adjusted to provide a modeled intensity profile that more closely corresponds to the desired lithographic result. Once the aspects of all apertures is determined, the filter element is fabricated and used in the optical lithographic process by placing the filter element in the optical lithography tool.

    摘要翻译: 公开了一种用于器件制造的工艺。 在该过程中,使用光学光刻技术将期望图案的图像引入到能量敏感材料中。 在该过程中,提供过滤元件。 滤光元件具有不同透射率的至少两个区域,每个区域指定孔径。 通过获得关于期望图案的信息和将用于将期望图案的图像引入能量敏感抗蚀剂材料的光学光刻工具来选择区域。 然后设计一种过滤元件,其提供在开发时将提供尺寸在可接受的工艺公差内的特征的图像。 过滤器元件通过对滤波器元件的每个孔的影响对期望图案的图像的强度分布进行建模来设计。 然后确定孔的组合效果。 如果需要,调整所提出的一个或多个孔的一个方面(透射率,取向,尺寸)以提供更接近于所需光刻结果的建模强度分布。 一旦确定了所有孔的方面,则通过将滤光元件放置在光刻工具中,在光学平版印刷工艺中制造和使用滤光元件。