公开(公告)号：US20230144501A1

公开(公告)日：2023-05-11

申请号：US17985004

申请日：2022-11-10

Applicant: Raytheon BBN Technologies, Corp.

Inventor： Moe D. Soltani ,  James G. Leatham ,  Duane D. Smith ,  Alexander Niechayev

IPC: G02B6/12 ,  G02B6/125

CPC classification number: G02B6/12019 ,  G02B6/125 ,  G02B2006/12142

Abstract: A photonic integrated circuit (PIC) is disclosed herein. The PIC can include a substrate, a main optical waveguide supported by the substrate. The main optical waveguide can be in communication with an electromagnetic radiation source, and configured to receive electromagnetic radiation from the electromagnetic radiation source. A first branch optical waveguide can be optically coupled to the main optical waveguide at a first location. An optical phased array (OPA) can include plurality of array elements, each having an optical antenna and an optical phase modulator. At least some array elements within a first subset of the plurality of array elements can be optically coupled to the first branch optical waveguide wherein locations of at least some of the plurality of array elements are aperiodic in one or more directions on the substrate.