公开(公告)号：US20240103245A1

公开(公告)日：2024-03-28

申请号：US18313966

申请日：2023-05-08

Applicant: Raytheon Company

Inventor： Adam R. Girard ,  James A. Aranda ,  Gabriel A. Payan ,  John M. Chesser ,  Ly Dinh Nguyen

IPC: G02B7/00 ,  F17C13/00

CPC classification number: G02B7/008 ,  F17C13/006 ,  F17C2227/0383 ,  F17C2227/0397 ,  F17C2270/0509

Abstract: An apparatus includes a Dewar having an endcap. The apparatus also includes a heat sink and a multiaxial thermal shoe having a thermal interface material and configured to thermally couple the endcap of the Dewar to the heat sink via one of at least two axial surfaces. The multiaxial thermal shoe is configured to transfer thermal energy between the endcap of the Dewar and the heat sink without structurally coupling the Dewar to the heat sink. The multiaxial thermal shoe may be configured to hold the thermal interface material against the endcap. The multiaxial thermal shoe may couple to the heat sink via a first axial surface in-line with an optical centerline or a second axial surface crosswise to the optical centerline.