公开(公告)号：US11150025B2

公开(公告)日：2021-10-19

申请号：US15976672

申请日：2018-05-10

Applicant: Raytheon Company

Inventor： Kirk A. Miller ,  Gary J. Schwartz ,  Aaron M. Dossman ,  Mark A. Michnevitz

IPC: F28D1/053 ,  F16M11/12 ,  F28F9/013 ,  F28D1/02 ,  F28D21/00 ,  B64D47/08 ,  F16M13/02 ,  B64C39/02

Abstract: An apparatus includes a heat exchanger configured to be positioned around and coupled to a multi-axis gimbal. The heat exchanger includes an inlet configured to receive fluid containing heat generated by an equipment package carried by the gimbal. The heat exchanger also includes multiple heat rejection interfaces configured to reject the heat from the fluid into surrounding air in order to cool the fluid. The heat exchanger further includes an outlet configured to provide the cooled fluid from the heat exchanger. The heat rejection interfaces of the heat exchanger extend around the heat exchanger and are configured to reject the heat from the fluid regardless of a direction in which the gimbal is pointing the equipment package.