公开(公告)号：US11826849B2

公开(公告)日：2023-11-28

申请号：US17173932

申请日：2021-02-11

Applicant: Raytheon Technologies Corporation

Inventor： Ashwin Raghavan ,  Enrique E. Montero ,  Max A. Kaplan ,  Eli N. Ross ,  Mario P. Bochiechio

IPC: C22C19/03 ,  C22F1/10 ,  B23K20/233 ,  B23K20/12 ,  B23K11/04 ,  B23K35/30 ,  B23K101/00

CPC classification number: B23K20/233 ,  B23K11/04 ,  B23K20/12 ,  B23K35/3033 ,  C22C19/03 ,  C22F1/10 ,  B23K2101/001 ,  Y10T428/12493 ,  Y10T428/12861

Abstract: A joining method includes performing a first heat treatment step on a first superalloy workpiece and a second superalloy workpiece wherein at least one of the first and second superalloy workpieces include a gamma matrix phase and a gamma-prime precipitate phase. The first and second superalloy workpieces are joined using a solid state joining process, subjected to a post-weld stress relief operation and a final aging heat treatment.

公开(公告)号：US20210316392A1

公开(公告)日：2021-10-14

申请号：US17173932

申请日：2021-02-11

Applicant: Raytheon Technologies Corporation

Inventor： Ashwin Raghavan ,  Enrique E. Montero ,  Max A. Kaplan ,  Eli N. Ross ,  Mario P. Bochiechio

IPC: B23K20/233 ,  C22C19/03 ,  C22F1/10 ,  B23K20/12 ,  B23K11/04 ,  B23K35/30

Abstract: A joining method includes performing a first heat treatment step on a first superalloy workpiece and a second superalloy workpiece wherein at least one of the first and second superalloy workpieces include a gamma matrix phase and a gamma-prime precipitate phase. The first and second superalloy workpieces are joined using a solid state joining process, subjected to a post-weld stress relief operation and a final aging heat treatment.