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公开(公告)号:US20230219858A1
公开(公告)日:2023-07-13
申请号:US18117825
申请日:2023-03-06
Applicant: Raytheon Technologies Corporation
Inventor: Ying She , Rajiv Ranjan , Zissis A. Dardas , Gajawalli V. Srinivasan , Lesia V. Protsailo
IPC: C04B35/80 , H01L21/02 , C04B35/628 , C23C16/455 , C23C16/04 , C04B35/565 , C04B35/515 , C01B32/956
CPC classification number: C04B35/80 , H01L21/02529 , C04B35/62868 , C23C16/45544 , C23C16/045 , C04B35/565 , C04B35/515 , C01B32/956 , C04B2235/614
Abstract: A method for fabricating a component according to an example of the present disclosure includes the steps of depositing a stoichiometric precursor layer onto a preform, and densifying the preform by depositing a matrix material onto the stoichiometric precursor layer. An alternate method and a component are also disclosed.
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公开(公告)号:US11597686B2
公开(公告)日:2023-03-07
申请号:US17025544
申请日:2020-09-18
Applicant: Raytheon Technologies Corporation
Inventor: Ying She , Rajiv Ranjan , Zissis A. Dardas , Gajawalli V. Srinivasan , Lesia V. Protsailo
IPC: C23C16/04 , C04B35/80 , C23C16/455 , H01L21/02 , C04B35/628 , C04B35/565 , C04B35/515 , C01B32/956
Abstract: A method for fabricating a component according to an example of the present disclosure includes the steps of depositing a stoichiometric precursor layer onto a preform, and densifying the preform by depositing a matrix material onto the stoichiometric precursor layer. An alternate method and a component are also disclosed.
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公开(公告)号:US20210002766A1
公开(公告)日:2021-01-07
申请号:US17025544
申请日:2020-09-18
Applicant: Raytheon Technologies Corporation
Inventor: Ying She , Rajiv Ranjan , Zissis A. Dardas , Gajawalli V. Srinivasan , Lesia V. Protsailo
IPC: C23C16/455 , H01L21/02 , C23C16/04 , C04B35/628 , C04B35/565
Abstract: A method for fabricating a component according to an example of the present disclosure includes the steps of depositing a stoichiometric precursor layer onto a preform, and densifying the preform by depositing a matrix material onto the stoichiometric precursor layer. An alternate method and a component are also disclosed.
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