公开(公告)号：US20230130888A1

公开(公告)日：2023-04-27

申请号：US18145870

申请日：2022-12-23

申请人： Redline Communications Inc.

发明人： Mark Douglas Bassett ,  Bradford KM Stimpson ,  Alexandre Gourari

IPC分类号： H05K7/02 ,  H05K5/02 ,  H01R12/73

摘要： A modular die cast enclosure comprising a top section with a top mid-plane and a bottom section with a bottom mid-plane and an internal bottom cover. The bottom section having one or more of a first type of connectors. The top section having one or more of a second type of connectors on. The internal bottom cover having one or more of a third type of connectors. Wherein said first type of connectors couple with said second type of connectors when the top section is placed on the bottom section and allow to electrically connect said top and bottom sections via said third type of connectors.

公开(公告)号：US11589475B2

公开(公告)日：2023-02-21

申请号：US17380417

申请日：2021-07-20

申请人： Redline Communications Inc.

发明人： Mark Douglas Bassett ,  Bradford K M Stimpson ,  Alexandre Gourari

IPC分类号： H05K7/02 ,  H05K7/04 ,  H05K5/02 ,  H01R12/73

摘要： A modular die cast enclosure comprising a top section with a top mid-plane and a bottom section with a bottom mid-plane and an internal bottom cover. The bottom section having one or more of a first type of connectors. The top section having one or more of a second type of connectors on. The internal bottom cover having one or more of a third type of connectors. Wherein said first type of connectors couple with said second type of connectors when the top section is placed on the bottom section and allow to electrically connect said top and bottom sections via said third type of connectors.