公开(公告)号：US20140234995A1

公开(公告)日：2014-08-21

申请号：US14182563

申请日：2014-02-18

Applicant: Regents of the University of Minnesota

Inventor： Mo Li ,  Yu Chen

IPC: H01L21/306

CPC classification number: G02F1/025 ,  G02B6/12007 ,  G02B6/136 ,  G02B2006/12061 ,  G02B2006/12138 ,  H01L21/7806

Abstract: Methods to physically transfer highly integrated silicon photonic devices from high-quality, crystalline semiconductors on to flexible plastic substrates by a transfer-and-bond fabrication method. With this method, photonic circuits including interferometers and resonators can be transferred onto flexible plastic substrates with preserved optical functionalities and performance.

Abstract translation: 通过转移和键合制造方法将高度集成的硅光子器件从高质量的晶体半导体物理转移到柔性塑料基板上的方法。 使用这种方法，包括干涉仪和谐振器的光子电路可以转移到具有保留的光学功能和性能的柔性塑料基板上。