Abstract:
An anode region and a cathode region of a photodiode are formed in a semiconductor substrate. At a main surface of the semiconductor substrate, a plurality of first STI regions are formed on the cathode region, and an oxide film is formed between the plurality of first STI regions. A shield electrode is formed on the plurality of first STI regions and the oxide film. A thickness of each of the plurality of first STI regions is smaller than a thickness of second STI region.
Abstract:
The semiconductor device of the present invention includes: a MOSFET having a gate electrode formed via a gate insulating film over a semiconductor layer and source and drain regions formed in the semiconductor layer on both sides of the gate electrode; and a diode. The diode has an n+-type semiconductor region, a p-type semiconductor region and a p+-type semiconductor region. Then, the gate electrode is connected to the n+-type semiconductor region via an n-type semiconductor region formed so as to be connected to the n+-type semiconductor region. Also, the p+-type semiconductor region is connected to a semiconductor layer below the gate electrode. In this way, by providing the diode between the back gate and gate electrode of the MOSFET, breakage of the gate insulating film can be prevented.