公开(公告)号：US20170263550A1

公开(公告)日：2017-09-14

申请号：US15397762

申请日：2017-01-04

Applicant: Renesas Electronics Corporation

Inventor： Hiroki NISHIDA ,  Naozumi MORINO ,  Toshimi MIZUTANI

IPC: H01L23/528 ,  G06F17/50

CPC classification number: H01L23/528 ,  G06F17/5077 ,  H01L23/5226 ,  H01L28/00

Abstract: A metal wiring layer includes a plurality of hierarchical blocks each divided by a side that serves as a boundary. One of the hierarchical blocks is placed to extend along the outer periphery of the self hierarchical block, and includes: a shield ring wire formed by a single metal wire or by a plurality of metal wires; and a plurality of metal wires that are placed inside the shield ring wire and extend in a preferential direction determined in advance. The shield ring wire has a first section extending in the preferential direction and a second section extending in a non-preferential direction perpendicular to the preferential direction.