SEMICONDUCTOR DEVICE
    1.
    发明申请
    SEMICONDUCTOR DEVICE 审中-公开
    半导体器件

    公开(公告)号:US20150243735A1

    公开(公告)日:2015-08-27

    申请号:US14711771

    申请日:2015-05-14

    Abstract: A gate interconnection portion (GHB) includes a first gate interconnection portion (GHB1), a second gate interconnection portion (GHB2), and a third gate interconnection portion (GHB3). The first gate interconnection portion (GHB1) is formed in parallel to a Y axis direction toward a power supply interconnection and extends to a prescribed position within an element formation region (PER). The second gate interconnection portion (GHB2) is formed in parallel to a direction obliquely bent with respect to the Y-axis direction from the first gate interconnection portion (GHB1) toward the power supply interconnection, and extends across a boundary between the element formation region (PER) and an element isolation insulating film (EB), which is in parallel to an X axis direction. The third gate interconnection portion (GHB3) further extends in parallel to the Y-axis direction from the second gate interconnection portion (GHB2) toward the power supply interconnection.

    Abstract translation: 门互连部分(GHB)包括第一栅极互连部分(GHB1),第二栅极互连部分(GHB2)和第三栅极互连部分(GHB3)。 第一栅极互连部分(GHB1)平行于Y轴方向朝向电源互连形成,并延伸到元件形成区域(PER)内的规定位置。 第二栅极互连部(GHB2)与从第一栅极互连部(GHB1)朝向电源互连方向相对于Y轴方向倾斜地弯曲的方向平行地形成,并且跨越元件形成区域 (PER)和与X轴方向平行的元件隔离绝缘膜(EB)。 第三栅极互连部分(GHB3)还从第二栅极互连部分(GHB2)朝着电源互连方向平行于Y轴方向延伸。

Patent Agency Ranking