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公开(公告)号：US12173936B2
公开(公告)日：2024-12-24
申请号：US18492634
申请日：2023-10-23
Applicant: Rheem Manufacturing Company
Inventor： Hari Krishna Kanagala , Harold Gene Havard, Jr. , Robert Leonard Long , Rosa Leal , David Kauppila , Junjie Luo
Abstract: The disclosed technology includes an air system including a first interlaced microchannel heat exchanger and a second interlaced microchannel heat exchanger. The air system can include a plurality of fluidly separated refrigerant circuits, and each of the refrigerant circuits can be configured to flow through the first interlaced microchannel heat exchanger and the second interlaced microchannel heat exchanger. The first interlaced microchannel heat exchanger can be located indoors, and the second interlaced microchannel heat exchanger can be located outdoors. Each of the refrigerant circuits can include its own compressor and expansion valve.
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公开(公告)号：US20240053068A1
公开(公告)日：2024-02-15
申请号：US18492634
申请日：2023-10-23
Applicant: Rheem Manufacturing Company
Inventor： Hari Krishna Kanagala , Harold Gene Havard, JR. , Robert Leonard Long , Rosa Leal , David Kauppila , Junjie Luo
CPC classification number: F25B39/00 , F25B13/00 , F25B2339/041 , F25B39/04
Abstract: The disclosed technology includes an air system including a first interlaced microchannel heat exchanger and a second interlaced microchannel heat exchanger. The air system can include a plurality of fluidly separated refrigerant circuits, and each of the refrigerant circuits can be configured to flow through the first interlaced microchannel heat exchanger and the second interlaced microchannel heat exchanger. The first interlaced microchannel heat exchanger can be located indoors, and the second interlaced microchannel heat exchanger can be located outdoors. Each of the refrigerant circuits can include its own compressor and expansion valve.
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公开(公告)号：US11828499B2
公开(公告)日：2023-11-28
申请号：US17573267
申请日：2022-01-11
Applicant: Rheem Manufacturing Company
Inventor： Hari Krishna Kanagala , Harold Gene Havard, Jr. , Robert Leonard Long , Rosa Leal , David Kauppila , Junjie Luo
CPC classification number: F25B39/00 , F25B13/00 , F25B39/028 , F25B39/04 , F25B2339/041 , F25B2400/06
Abstract: The disclosed technology includes an air system including a first interlaced microchannel heat exchanger and a second interlaced microchannel heat exchanger. The air system can include a plurality of fluidly separated refrigerant circuits, and each of the refrigerant circuits can be configured to flow through the first interlaced microchannel heat exchanger and the second interlaced microchannel heat exchanger. The first interlaced microchannel heat exchanger can be located indoors, and the second interlaced microchannel heat exchanger can be located outdoors. Each of the refrigerant circuits can include its own compressor and expansion valve.
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