Compound angled pad end-effector
    1.
    发明授权
    Compound angled pad end-effector 有权
    复合角垫片末端执行器

    公开(公告)号:US07048316B1

    公开(公告)日:2006-05-23

    申请号:US10194529

    申请日:2002-07-12

    IPC分类号: B66C1/00

    摘要: This invention provides a method and a support device for a wafer transfer process which has a first vertical, second horizontal and third compound angled surfaces, as well as a pair of sidewalls all contiguously connected to one another. The third surface has at least two angled receiving surfaces whereby one of such angled receiving surfaces has a small angle of incline for initially receiving and delivering a wafer. The other angled receiving surface has a steep angle of incline for effectively receiving, holding and transporting a semiconductor wafer by increasing an effective coefficient of friction of the wafer to provide a secure resting point for such wafer during a transfer process while simultaneously increasing the speed thereof. Furthermore, a hole may be provided in the support device for attaching the support device, or a plurality of support devices having holes, to an end-effector.

    摘要翻译: 本发明提供了一种用于晶片转移过程的方法和支持装置,其具有第一垂直,第二水平和第三复合物的倾斜表面,以及一对彼此连续地连接的侧壁。 第三表面具有至少两个成角度的接收表面,由此这种成角度的接收表面中的一个具有小的倾斜角度,用于初始接收和传送晶片。 另一个倾斜的接收表面具有陡峭的倾斜角,用于通过增加晶片的有效摩擦系数来有效地接收,保持和传输半导体晶片,以在转移过程中为这种晶片提供安全的静止点,同时增加其速度 。 此外,可以在支撑装置中设置孔,用于将支撑装置或具有孔的多个支撑装置附接到端部执行器。