公开(公告)号：US07546943B2

公开(公告)日：2009-06-16

申请号：US11242324

申请日：2005-10-03

申请人： Richard M. Barina ,  Dean Frederick Herring ,  John Paul Scavuzzo ,  Paul Andrew Wormsbecher

发明人： Richard M. Barina ,  Dean Frederick Herring ,  John Paul Scavuzzo ,  Paul Andrew Wormsbecher

IPC分类号： H05K7/20

CPC分类号： B23K37/0408 ,  B23K2101/42

摘要： An apparatus, system, and method are disclosed for positioning a printed circuit board component. A clamping member applies a clamping force to a levering member linked to a positioning member. The levering member biases the positioning member toward a printed circuit board in response to the clamping force. The positioning member positions the printed circuit board and a component disposed on the printed circuit board in response to the positioning member bias. In one embodiment, the positioning member positions the component to contact a thermal device.

摘要翻译： 公开了用于定位印刷电路板部件的装置，系统和方法。 夹紧构件向连接到定位构件的杠杆构件施加夹紧力。 响应于夹紧力，杠杆部件朝向印刷电路板偏压定位构件。 定位构件响应于定位构件偏置定位印刷电路板和布置在印刷电路板上的部件。 在一个实施例中，定位构件将部件定位成接触热装置。

公开(公告)号：US07224587B2

公开(公告)日：2007-05-29

申请号：US10871719

申请日：2004-06-18

申请人： Karl Klaus Dittus ,  Timothy Samuel Farrow ,  Walter Adrian Goodman ,  Dean Frederick Herring ,  William Fred Martin-Otto ,  Rodrigo Samper ,  John Paul Scavuzzo

发明人： Karl Klaus Dittus ,  Timothy Samuel Farrow ,  Walter Adrian Goodman ,  Dean Frederick Herring ,  William Fred Martin-Otto ,  Rodrigo Samper ,  John Paul Scavuzzo

IPC分类号： H05K7/20 ,  H01L23/34 ,  F28F7/00 ,  A44B21/00

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  Y10T24/44017 ,  Y10T24/44026 ,  H01L2924/00

摘要： A chip sandwich includes a heat sink, a retention module, a computer chip mounted in a socket on a mother board, a wave washer spring and a mounting plate. The heat sink is mounted on the retention module using cams, hooks and heat sink tabs to provide an initial orientation of the heat sink over the computer chip. To provide final contact pressure between the heat sink and the computer chip, a wave washer spring oriented beneath the computer chip and under the mother board provides an upward pressure against the bottom of the mother board, and particularly against the center of the computer chip. Thus, by the wave washer spring pushing against the center of the computer chip, secure contact pressure is provided between the heat sink and the computer chip, while minimizing the amount of pressure between the computer chip's pins and the chip socket.

摘要翻译： 芯片夹层包括散热器，保持模块，安装在母板上的插座中的计算机芯片，波形垫圈弹簧和安装板。 散热器使用凸轮，钩和散热片安装在保持模块上，以提供散热器在计算机芯片上的初始定向。 为了在散热器和计算机芯片之间提供最终的接触压力，在计算机芯片下方和母板下方定向的波形垫圈弹簧提供抵抗母板底部，特别是抵靠计算机芯片中心的向上压力。 因此，通过波形垫圈弹簧推靠着计算机芯片的中心，在散热器和计算机芯片之间提供牢固的接触压力，同时最小化计算机芯片的引脚和芯片插座之间的压力量。

公开(公告)号：US06781827B2

公开(公告)日：2004-08-24

申请号：US10372528

申请日：2001-08-16

申请人： Walter Adrian Goodman ,  John Paul Scavuzzo

发明人： Walter Adrian Goodman ,  John Paul Scavuzzo

IPC分类号： G06F116

CPC分类号： G06F1/184 ,  G06F1/187

摘要： A computing system includes a pivoting mounting structure for mounting one or more electronic devices. The mounting structure is itself mounted to pivot between an operating position, within the computing system, and a service position, with the pivoting mounting structure extending outside the computing system for the installation or removal of electronic devices. A releasable latch prevents movement of the mounting structure from its service position.

摘要翻译： 计算系统包括用于安装一个或多个电子设备的枢转安装结构。 安装结构本身安装成在计算系统内的操作位置和使用位置之间枢转，其中枢转安装结构延伸到计算系统外部，以便安装或移除电子设备。 可拆卸的闩锁防止安装结构从其使用位置移动。