Heat sink and chip sandwich system
    1.
    发明申请
    Heat sink and chip sandwich system 有权
    散热片和芯片夹心系统

    公开(公告)号:US20050281001A1

    公开(公告)日:2005-12-22

    申请号:US10871719

    申请日:2004-06-18

    IPC分类号: A44B99/00 H01L23/40 H05K7/20

    摘要: A chip sandwich includes a heat sink, a retention module, a computer chip mounted in a socket on a mother board, a wave washer spring and a mounting plate. The heat sink is mounted on the retention module using cams, hooks and heat sink tabs to provide an initial orientation of the heat sink over the computer chip. To provide final contact pressure between the heat sink and the computer chip, a wave washer spring oriented beneath the computer chip and under the mother board provides an upward pressure against the bottom of the mother board, and particularly against the center of the computer chip. Thus, by the wave washer spring pushing against the center of the computer chip, secure contact pressure is provided between the heat sink and the computer chip, while minimizing the amount of pressure between the computer chip's pins and the chip socket.

    摘要翻译: 芯片夹层包括散热器,保持模块,安装在母板上的插座中的计算机芯片,波形垫圈弹簧和安装板。 散热器使用凸轮,钩和散热片安装在保持模块上,以提供散热器在计算机芯片上的初始定向。 为了在散热器和计算机芯片之间提供最终的接触压力,在计算机芯片下方和母板下方定向的波形垫圈弹簧提供抵抗母板底部,特别是抵靠计算机芯片中心的向上压力。 因此,通过波形垫圈弹簧推靠着计算机芯片的中心,在散热器和计算机芯片之间提供牢固的接触压力,同时最小化计算机芯片的引脚和芯片插座之间的压力量。

    Heat sink and chip sandwich system
    2.
    发明授权
    Heat sink and chip sandwich system 有权
    散热片和芯片夹心系统

    公开(公告)号:US07224587B2

    公开(公告)日:2007-05-29

    申请号:US10871719

    申请日:2004-06-18

    摘要: A chip sandwich includes a heat sink, a retention module, a computer chip mounted in a socket on a mother board, a wave washer spring and a mounting plate. The heat sink is mounted on the retention module using cams, hooks and heat sink tabs to provide an initial orientation of the heat sink over the computer chip. To provide final contact pressure between the heat sink and the computer chip, a wave washer spring oriented beneath the computer chip and under the mother board provides an upward pressure against the bottom of the mother board, and particularly against the center of the computer chip. Thus, by the wave washer spring pushing against the center of the computer chip, secure contact pressure is provided between the heat sink and the computer chip, while minimizing the amount of pressure between the computer chip's pins and the chip socket.

    摘要翻译: 芯片夹层包括散热器,保持模块,安装在母板上的插座中的计算机芯片,波形垫圈弹簧和安装板。 散热器使用凸轮,钩和散热片安装在保持模块上,以提供散热器在计算机芯片上的初始定向。 为了在散热器和计算机芯片之间提供最终的接触压力,在计算机芯片下方和母板下方定向的波形垫圈弹簧提供抵抗母板底部,特别是抵靠计算机芯片中心的向上压力。 因此,通过波形垫圈弹簧推靠着计算机芯片的中心,在散热器和计算机芯片之间提供牢固的接触压力,同时最小化计算机芯片的引脚和芯片插座之间的压力量。

    System for mounting components in a computer chassis
    3.
    发明授权
    System for mounting components in a computer chassis 失效
    将组件安装在计算机机箱中的系统

    公开(公告)号:US06238026B1

    公开(公告)日:2001-05-29

    申请号:US09469404

    申请日:1999-12-22

    IPC分类号: A47B9700

    CPC分类号: G06F1/184 G06F1/187

    摘要: A system for mounting components within a frame of a personal computer where access to only one side of the frame is needed to mount or remove the components with fasteners and fastening tools. The components are secured and restrained from movement in three orthogonal directions. The fasteners are mounted to the exposed side. Bracket guides and spring fingers extend from the frame to provide location and biasing forces to secure the components in their proper locations. This system requires fewer fasteners and reduces assembly time during manufacturing and/or repair. It is easier and quicker to remove and replace a defective component or one which is being upgraded in the system.

    摘要翻译: 用于将部件安装在个人计算机的框架内的系统,其中只需要使用框架的一侧来安装或拆除带有紧固件和紧固工具的部件。 组件被固定和限制在三个正交方向的运动。 紧固件安装到暴露的一侧。 支架引导件和弹簧指从框架延伸以提供位置和偏置力,以将部件固定在其适当的位置。 该系统在制造和/或修理期间需要较少的紧固件并减少组装时间。 拆卸和更换有缺陷的组件或系统中正在升级的组件变得更加容易和快捷。

    Removable structures for mounting computer drive devices, pivotable between operating and service positions
    4.
    发明授权
    Removable structures for mounting computer drive devices, pivotable between operating and service positions 有权
    用于安装计算机驱动设备的可移动结构,可在操作和维护位置之间枢转

    公开(公告)号:US06507487B1

    公开(公告)日:2003-01-14

    申请号:US09708349

    申请日:2000-11-08

    IPC分类号: G06F116

    CPC分类号: G06F1/184 G06F1/187

    摘要: A computing system includes a frame and a drive mounting structure for mounting one or more drive units within the computing system, with the drive mounting structure being pivotally and removably mounted on the frame to move between an operating position, in which an internal end of a drive unit mounted within the drive mounting structure is held within the computing system, and a service position, in which the internal end of the drive unit extends outward from the computing system. In the service position, access is provided to an open end of the drive mounting structure, into which the drive unit can be installed, to the internal end of the drive unit, for attachment of a cable, and to a side of the drive mounting structure, through which fasteners are driven to mount the drive unit within the drive mounting structure.

    摘要翻译: 计算系统包括框架和用于在计算系统内安装一个或多个驱动单元的驱动器安装结构,其中驱动器安装结构可枢转地和可移除地安装在框架上以在操作位置之间移动, 安装在驱动器安装结构内的驱动单元保持在计算系统内,以及服务位置,其中驱动单元的内端从计算系统向外延伸。 在使用位置,将驱动单元可安装到其中的驱动器安装结构的开口端,驱动单元的内部端部,用于连接电缆和驱动器安装侧的通路 结构,通过该结构驱动紧固件将驱动单元安装在驱动器安装结构内。