公开(公告)号：US20050212125A1

公开(公告)日：2005-09-29

申请号：US10514996

申请日：2003-05-23

申请人： Richard Spitz ,  Peter Urbach ,  Karin Hamsen

发明人： Richard Spitz ,  Peter Urbach ,  Karin Hamsen

IPC分类号： H01L23/24 ,  H01L23/62 ,  H01L23/34

CPC分类号： H01L24/01 ,  H01L23/24 ,  H01L23/62 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12036 ,  H01L2924/00

摘要： An electrical component, e.g., a press-in diode, is provided, which is suited for high currents and which ensures reverse-polarity protection. The electrical component includes at least one chip which is connected via soldering layers to a lead wire and a base. In the event of a rising temperature caused by polarity reversal, the clamp-type connection between the individual parts of the electrical component, e.g., the lead wire and the base, is released since the connecting plastic sheath softens, resulting in the release of the clamp-type connection, thereby interrupting the electrical connection and thus a current flow. At normal operating temperature, the clamp-type connection between the individual parts of the diode is ensured via a plastic sheath and a plastic sleeve, with bulges of the lead wire and the base protruding into the plastic sheath, thereby making the connection particularly stable.

摘要翻译： 提供了诸如压入二极管的电气部件，其适用于高电流并且确保反向极性保护。 电气部件包括至少一个通过焊接层连接到引线和基座的芯片。 在由极性反转引起的温度上升的情况下，电气部件的各个部件（例如引线和基座）之间的夹紧型连接被释放，因为连接塑料护套软化，导致释放 夹紧型连接，从而中断电连接，从而中断电流。 在正常工作温度下，通过塑料护套和塑料套筒确保二极管各部件之间的夹紧型连接，导线和底座的凸起突出到塑料护套中，从而使连接特别稳定。

公开(公告)号：US07675156B2

公开(公告)日：2010-03-09

申请号：US10514996

申请日：2003-05-23

申请人： Richard Spitz ,  Peter Urbach ,  Karin Hamsen

发明人： Richard Spitz ,  Peter Urbach ,  Karin Hamsen

IPC分类号： H01L23/31

CPC分类号： H01L24/01 ,  H01L23/24 ,  H01L23/62 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12036 ,  H01L2924/00

摘要： An electrical component, e.g., a press-in diode, is provided, which is suited for high currents and which ensures reverse-polarity protection. The electrical component includes at least one chip which is connected via soldering layers to a lead wire and a base. In the event of a rising temperature caused by polarity reversal, the clamp-type connection between the individual parts of the electrical component, e.g., the lead wire and the base, is released since the connecting plastic sheath softens, resulting in the release of the clamp-type connection, thereby interrupting the electrical connection and thus a current flow. At normal operating temperature, the clamp-type connection between the individual parts of the diode is ensured via a plastic sheath and a plastic sleeve, with bulges of the lead wire and the base protruding into the plastic sheath, thereby making the connection particularly stable.

摘要翻译： 提供了诸如压入二极管的电气部件，其适用于高电流并且确保反向极性保护。 电气部件包括至少一个通过焊接层连接到引线和基座的芯片。 在由极性反转引起的温度升高的情况下，电气部件的各个部件（例如引线和基座）之间的夹紧型连接被释放，因为连接塑料护套软化，导致释放 夹紧型连接，从而中断电连接，从而中断电流。 在正常工作温度下，通过塑料护套和塑料套筒确保二极管各部件之间的夹紧型连接，导线和底座的凸起突出到塑料护套中，从而使连接特别稳定。

公开(公告)号：US20070105454A1

公开(公告)日：2007-05-10

申请号：US10575526

申请日：2004-11-08

申请人： Richard Spitz ,  Alfred Goerlach ,  Karin Hamsen ,  Jochen Dietrich

发明人： Richard Spitz ,  Alfred Goerlach ,  Karin Hamsen ,  Jochen Dietrich

IPC分类号： H01R13/10

CPC分类号： H01L23/051 ,  H01L23/049 ,  H01L24/01 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/00

摘要： A diode, e.g., a press-fit power diode for a rectifier in a motor vehicle, includes a semiconductor chip which is connected to a head wire and a base via solder layers. A plastic sheathing, which is situated at least in the chip area and includes a plastic sleeve, enables a hard casting compound to be used and establishes a mechanical connection between the base and the head wire and forms a housing together with the base. An undercut, which extends into the casting compound, and a gap between the sleeve and the edge of the base achieve a compact design. Bevels provided on both sides enable the diode to be pressed into the rectifier from two sides.

摘要翻译： 二极管，例如用于机动车辆中的整流器的压配功率二极管，包括通过焊料层连接到头线和基座的半导体芯片。 至少位于芯片区域中并且包括塑料套筒的塑料护套能够使用硬质铸造化合物，并在基座和头部线材之间建立机械连接并与基座一起形成壳体。 延伸到铸造复合体中的底切以及套筒和基部边缘之间的间隙实现了紧凑的设计。 两侧提供的斜角使得二极管可以从两侧压入整流器。

公开(公告)号：US08350378B2

公开(公告)日：2013-01-08

申请号：US10575526

申请日：2004-11-08

申请人： Richard Spitz ,  Alfred Goerlach ,  Karin Hamsen ,  Jochen Dietrich

发明人： Richard Spitz ,  Alfred Goerlach ,  Karin Hamsen ,  Jochen Dietrich

IPC分类号： H01L23/04

CPC分类号： H01L23/051 ,  H01L23/049 ,  H01L24/01 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/00

摘要： A diode, e.g., a press-fit power diode for a rectifier in a motor vehicle, includes a semiconductor chip which is connected to a head wire and a base via solder layers. A plastic sheathing, which is situated at least in the chip area and includes a plastic sleeve, enables a hard casting compound to be used and establishes a mechanical connection between the base and the head wire and forms a housing together with the base. An undercut, which extends into the casting compound, and a gap between the sleeve and the edge of the base achieve a compact design. Bevels provided on both sides enable the diode to be pressed into the rectifier from two sides.

摘要翻译： 二极管，例如用于机动车辆中的整流器的压配功率二极管，包括通过焊料层连接到头线和基座的半导体芯片。 至少位于芯片区域中并且包括塑料套筒的塑料护套能够使用硬质铸造化合物，并在基座和头部线材之间建立机械连接并与基座一起形成壳体。 延伸到铸造复合体中的底切以及套筒和基部边缘之间的间隙实现了紧凑的设计。 两侧提供的斜角使得二极管可以从两侧压入整流器。

公开(公告)号：US20060145354A1

公开(公告)日：2006-07-06

申请号：US10527310

申请日：2003-06-03

申请人： Karin Hamsen ,  Richard Siptz

发明人： Karin Hamsen ,  Richard Siptz

IPC分类号： H01L23/48

CPC分类号： H01L24/01 ,  H01L23/051 ,  H01L23/24 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/10253 ,  H01L2924/00

摘要： A diode having a press-fit base includes an axially extending mounting region for a semiconductor chip and a head wire affixed to the semiconductor chip. The head wire has a stepped wire connection or a region which forms a sealed housing together with the press-fit base and a sleeve. The cavities produced in the housing are filled with encapsulating material for stabilizing purposes, encapsulating material being present only inside the housing.

摘要翻译： 具有压入基座的二极管包括用于半导体芯片的轴向延伸的安装区域和固定到半导体芯片的头部导线。 头部导线具有阶梯形导线连接或与压配合基座和套筒一起形成密封壳体的区域。 在壳体中产生的空腔填充有用于稳定目的的封装材料，封装材料仅存在于壳体内。