INTEGRATED STRUCTURE OF SEMICONDUCTOR DEVICES HAVING SHARED CONTACT PLUG AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20240030297A1

    公开(公告)日:2024-01-25

    申请号:US18314684

    申请日:2023-05-09

    CPC classification number: H01L29/41725 H01L29/42376 H01L29/401

    Abstract: An integrated structure of semiconductor devices having a shared contact plug includes: a first device, a second device and a shared contact plug. The first device includes a first gate having a conduction region, two spacer regions and a protection region. The two spacer regions overlay and are connected with two ends of the conductive region, respectively. The protection region overlays and is connected with the spacer region located outside a shared side of the conductive region. The second device includes a shared region, wherein the shared region is located in a semiconductor layer which is located below and outside the protection region. The shared contact plug is formed on and in contact with the conductive region and the shared region. The first gate is electrically connected with the shared region through the shared contact plug, wherein the shared contact plug overlays and is connected with the protection region.

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