公开(公告)号：US20130083038A1

公开(公告)日：2013-04-04

申请号：US13252109

申请日：2011-10-03

Applicant: Rihui HE

Inventor： Rihui HE

IPC: G06T1/00 ,  H01L23/04 ,  H01L21/56

CPC classification number: B81B7/0058

Abstract: This disclosure provides systems, methods and apparatus for fabricating spacers for electromechanical systems devices. In one aspect, a method of forming a spacer on a spacer portion of a device surface of an electromechanical systems device includes exposing the device surface to spacer particles suspended in a fluid. The spacer particles are allowed to attach to the spacer portion. Each of the spacer particles can have at least one dimension of about 1 micron to 10 microns. The electromechanical systems device can also include a sacrificial layer that is subsequently removed between the device surface and a substrate surface of a substrate on which the electromechanical systems device is formed.

Abstract translation: 本公开提供了用于制造用于机电系统装置的间隔件的系统，方法和装置。 一方面，在机电系统装置的装置表面的间隔部分上形成间隔物的方法包括将装置表面暴露于悬浮在流体中的间隔物颗粒。 允许间隔物颗粒附着到间隔物部分。 每个间隔物颗粒可以具有约1微米至10微米的至少一个尺寸。 机电系统装置还可以包括牺牲层，其随后在器件表面和其上形成有机电系统器件的衬底的衬底表面之间移除。

公开(公告)号：US20130106875A1

公开(公告)日：2013-05-02

申请号：US13287801

申请日：2011-11-02

Applicant: Rihui HE ,  Ana Rangelova LONDERGAN ,  Evgeni Petrovich GOUSEV

Inventor： Rihui HE ,  Ana Rangelova LONDERGAN ,  Evgeni Petrovich GOUSEV

IPC: G06F13/14 ,  G02B26/00 ,  H05K3/00

CPC classification number: B81C1/00333 ,  B81C2201/0177 ,  B81C2201/0181 ,  B81C2203/0145

Abstract: This disclosure provides systems, methods, and apparatus for fabricating electromechanical systems devices. In one aspect, a method of sealing an electromechanical systems device includes etching a sacrificial layer. The sacrificial layer is formed between a surface of a substrate and a shell layer and is etched through etch holes in the shell layer formed over the electromechanical systems device. The etch holes in the shell layer have a diameter greater than about one micron. The shell layer is then treated. A seal layer is deposited on the treated shell layer. The seal layer hermetically seals the electromechanical systems device.

Abstract translation: 本公开提供了用于制造机电系统装置的系统，方法和装置。 一方面，密封机电系统装置的方法包括蚀刻牺牲层。 牺牲层形成在基底的表面和壳层之间，并通过在机电系统器件上形成的壳层中的蚀刻孔进行蚀刻。 壳层中的蚀刻孔的直径大于约1微米。 然后对壳层进行处理。 密封层沉积在经处理的壳层上。 密封层密封机电系统装置。