公开(公告)号：US20230406697A1

公开(公告)日：2023-12-21

申请号：US18323223

申请日：2023-05-24

Applicant: Robert Bosch GmbH

Inventor： Mohammad Abbasi Gavarti ,  Alexander Schoenhals ,  Andreas Menzel ,  Joachim Kreutzer

IPC: B81C1/00

CPC classification number: B81C1/00238 ,  B81C2203/0792 ,  B81C2203/0109 ,  B81B2201/0264

Abstract: A production method for a micromechanical sensor apparatus. The method includes: providing a bonded wafer stack comprising an ASIC wafer and a MEMS wafer, the ASIC wafer including ASIC switching devices and the MEMS wafer including MEMS sensor devices, an ASIC switching device and a corresponding MEMS sensor device are arranged one above the other such that they form a respective micromechanical sensor apparatus in the bonded wafer stack; providing a first packaging wafer having first front and rear faces; in the first rear face, the first packaging wafer has blind holes assigned to corresponding sensor detection regions of a respective MEMS sensor device; bonding the first rear face to the wafer stack such that the blind holes are each in fluid connection with the corresponding sensor detection region; backthinning, on the first front face, the first packaging wafer bonded to the wafer stack to expose the blind holes.