公开(公告)号：US20230393009A1

公开(公告)日：2023-12-07

申请号：US18249035

申请日：2021-11-24

Applicant: ROBERT BOSCH GMBH

Inventor： Dorothee Nonnenmacher ,  Elmar Kroner ,  Friedhelm Guenter ,  Joachim Friedl ,  Joachim Kreutzer ,  Klaus-Volker Schuett ,  Lars Sodan ,  Michael Raedler ,  Patrick Stihler ,  Raschid Baraki ,  Steven Maul ,  Yang Zou

IPC: G01L19/06

CPC classification number: G01L19/0645

Abstract: A method for manufacturing a pressure sensor having a pressure-sensitive medium. The method includes: providing a pressure sensor having a pressure sensor element, which is arranged in a receiving space of a housing of the pressure sensor; filling the receiving space with a pressure-sensitive medium; applying a second medium, which is immiscible with the pressure-sensitive medium, to a surface of the pressure-sensitive medium; forming a membrane in a boundary region between the pressure-sensitive medium and the second medium by way of a phase-transfer reaction between a first reactant and a second reactant, at least the first reactant or the second reactant being dissolved in the pressure-sensitive medium or in the second medium. A pressure sensor manufactured by the method is also described.

公开(公告)号：US20250066186A1

公开(公告)日：2025-02-27

申请号：US18720836

申请日：2023-01-30

Applicant: Robert Bosch GmbH

Inventor： David Slogsnat ,  Domenico Tangredi ,  Joachim Kreutzer ,  Manuel Salvatore Santoro ,  Massimiliano Musazzi

IPC: B81B7/00 ,  B81C99/00

Abstract: An environmental sensor. The environmental sensor includes: a MEMS element; an ASIC element electrically connected to the MEMS element by means of at least two bonding wires. T ASIC element includes an evaluation circuit designed to ascertain and evaluate a parasitic capacitance between the at least two bonding wires connected to pads of the MEMS element, in order to detect a material deposit on the environmental sensor.

公开(公告)号：US20240288324A1

公开(公告)日：2024-08-29

申请号：US18572026

申请日：2022-06-02

Applicant: Robert Bosch GmbH

Inventor： Joachim Kreutzer ,  Arne Dannenberg ,  David Slogsnat

IPC: G01L9/00 ,  G01L13/02

CPC classification number: G01L9/0047 ,  G01L9/0072 ,  G01L13/025

Abstract: A micromechanical pressure sensor element as well as a pressure sensing system comprising such a pressure sensor element, with which the pressure sensor element establishes an electrical contact in the event of a specified first pressure being applied. The pressure sensor element has a membrane that can be moved or deflected by an applied pressure. A first cavity into which the membrane can be deflected is provided below the membrane. Two contact elements are provided which come into contact with each other, in particular via a mechanical contact, on the basis of a first applied pressure being exceeded so that an electric contact is established. At least one first contact element, which is directly or indirectly connected to the membrane, and a second contact element, which is directly or indirectly connected to the cavity bottom, are provided.

公开(公告)号：US20230406697A1

公开(公告)日：2023-12-21

申请号：US18323223

申请日：2023-05-24

Applicant: Robert Bosch GmbH

Inventor： Mohammad Abbasi Gavarti ,  Alexander Schoenhals ,  Andreas Menzel ,  Joachim Kreutzer

IPC: B81C1/00

CPC classification number: B81C1/00238 ,  B81C2203/0792 ,  B81C2203/0109 ,  B81B2201/0264

Abstract: A production method for a micromechanical sensor apparatus. The method includes: providing a bonded wafer stack comprising an ASIC wafer and a MEMS wafer, the ASIC wafer including ASIC switching devices and the MEMS wafer including MEMS sensor devices, an ASIC switching device and a corresponding MEMS sensor device are arranged one above the other such that they form a respective micromechanical sensor apparatus in the bonded wafer stack; providing a first packaging wafer having first front and rear faces; in the first rear face, the first packaging wafer has blind holes assigned to corresponding sensor detection regions of a respective MEMS sensor device; bonding the first rear face to the wafer stack such that the blind holes are each in fluid connection with the corresponding sensor detection region; backthinning, on the first front face, the first packaging wafer bonded to the wafer stack to expose the blind holes.

公开(公告)号：US20220276108A1

公开(公告)日：2022-09-01

申请号：US17649832

申请日：2022-02-03

Applicant: Robert Bosch GmbH

Inventor： David Slogsnat ,  Joachim Kreutzer

IPC: G01L9/00

Abstract: A pressure sensor includes a micromechanical sensor element including a pressure-sensitive diaphragm, which spans a cavity in a base material and includes a diaphragm electrode. A fixed counter electrode is situated inside the cavity and, with the diaphragm electrode, forms a first measuring capacitor for detecting a first measuring pressure. A reference capacitor is situated inside the cavity and includes a first and a second fixed reference electrode. The pressure sensor is operable in a first operating mode, in which the first measuring capacitor and the first reference capacitor are interconnected in a first bridge circuit. The pressure sensor is operable in a second operating mode, in which the diaphragm electrode, the counter electrode and the reference electrodes are interconnected in such a way that the diaphragm electrode, together with the at least one first reference electrode, forms a second measuring capacitor for detecting a second measuring pressure.

公开(公告)号：US20250059025A1

公开(公告)日：2025-02-20

申请号：US18789780

申请日：2024-07-31

Applicant: Robert Bosch GmbH

Inventor： Martin Kittel ,  Joachim Kreutzer ,  Tamas Dogei

IPC: B81B7/00 ,  B81C99/00

Abstract: A method for detecting contamination of a micro-electromechanical sensor of a sensor module using a heater, wherein the sensor module has a temperature sensor arranged at a distance from the heater and from the micro-electromechanical sensor. The heater heats the sensor, which is measured by the temperature sensor. The sensor measures physical quantities at different times. The measured physical quantities are compensated based on the temperatures measured at the different times. It is ascertained based on the compensated physical quantities and the temperature difference between the different times whether the micro-electromechanical sensor is free of contamination or has contamination. A system for detecting contamination of a micro-electromechanical sensor of a sensor module, a computer program and a machine-readable storage medium, are also described.

公开(公告)号：US20240344910A1

公开(公告)日：2024-10-17

申请号：US18579678

申请日：2022-06-02

Applicant: Robert Bosch GmbH

Inventor： Joachim Kreutzer ,  Arne Dannenberg ,  David Slogsnat

IPC: G01L9/00 ,  G01L19/06

CPC classification number: G01L9/0042 ,  G01L9/0073 ,  G01L19/0618

Abstract: A capacitive pressure sensor element. The capacitive pressure sensor element includes a first measuring capacitor, which generates a first sensor signal in a first pressure range, and a second measuring capacitor, which is used as a reference capacitor in the first pressure range and which generates a second pressure-based sensor signal in the second pressure range. A pressure sensor system which has at least two of the pressure sensor elements, and methods for producing the pressure sensor the pressure sensor system are also described.

公开(公告)号：US11821803B2

公开(公告)日：2023-11-21

申请号：US17393759

申请日：2021-08-04

Applicant: Robert Bosch GmbH

Inventor： Dorothee Nonnenmacher ,  Gustav Klett ,  Joachim Kreutzer ,  Joachim Friedl ,  Lars Sodan

IPC: G01L9/00 ,  G01L19/06

CPC classification number: G01L19/0627 ,  G01L9/0041

Abstract: A sensor includes a sensing element for detecting a property and/or a composition of a surrounding medium of the sensor, a transmission medium for transmitting a property and/or a composition of the surroundings medium onto the sensing element, the transmission medium being situated in such a way that the transmission medium is applied to the sensing element, and a cover, which distances the transmission medium from the surrounding medium, the cover being manufactured from a self-healing material, in particular, the cover being designed as a flexible membrane which is made up of a self-healing material.

公开(公告)号：US20230273236A1

公开(公告)日：2023-08-31

申请号：US18040185

申请日：2021-07-15

Applicant: Robert Bosch GmbH

Inventor： Joachim Kreutzer ,  David Slogsnat ,  Gabriele Cazzaniga ,  Massimiliano Musazzi ,  Timon Brueckner

IPC: G01P15/125 ,  G01P1/00

CPC classification number: G01P15/125 ,  G01P1/00

Abstract: A method for assessing the state of a sensor. The sensor comprises a deflectable micromechanical sensor structure for detecting a physical input variable and converting the physical input variable into an electrical sensor signal. A medium surrounding the sensor acts on the micromechanical sensor structure. The micromechanical sensor structure is deflectable using an excitation signal. The method includes: generating an excitation signal using a driver unit; outputting the excitation signal to the micromechanical sensor structure; deflecting the micromechanical sensor structure using the excitation signal; detecting a response behavior of the micromechanical sensor structure in response to the excitation signal; comparing the response behavior to a reference behavior to determine a measure of deviation for the response behavior in relation to the reference behavior; and assessing, based on the measure of deviation, the state of the sensor with respect to the presence of a deposit.

公开(公告)号：US11630012B2

公开(公告)日：2023-04-18

申请号：US17649832

申请日：2022-02-03

Applicant: Robert Bosch GmbH

Inventor： David Slogsnat ,  Joachim Kreutzer

IPC: G01L9/00

Abstract: A pressure sensor includes a micromechanical sensor element including a pressure-sensitive diaphragm, which spans a cavity in a base material and includes a diaphragm electrode. A fixed counter electrode is situated inside the cavity and, with the diaphragm electrode, forms a first measuring capacitor for detecting a first measuring pressure. A reference capacitor is situated inside the cavity and includes a first and a second fixed reference electrode. The pressure sensor is operable in a first operating mode, in which the first measuring capacitor and the first reference capacitor are interconnected in a first bridge circuit. The pressure sensor is operable in a second operating mode, in which the diaphragm electrode, the counter electrode and the reference electrodes are interconnected in such a way that the diaphragm electrode, together with the at least one first reference electrode, forms a second measuring capacitor for detecting a second measuring pressure.