公开(公告)号：US20230219808A1

公开(公告)日：2023-07-13

申请号：US18151631

申请日：2023-01-09

Applicant: Robert Bosch GmbH

Inventor： Andreas Prinzen ,  Christof Schwenk ,  Frank Reichenbach ,  Friedjof Heuck ,  Heiko Stahl ,  Nicolas Schorr

IPC: B81C1/00

CPC classification number: B81C1/00571 ,  B81C2201/0198 ,  B81C2203/0109 ,  B81C2201/0132

Abstract: A method for producing a bonding pad for a micromechanical sensor element. The method includes: depositing a first metal layer onto a top face of the functional layer, and depositing a second metal layer onto the first metal layer, wherein only the first layer or only the second layer is formed in a border region extending around a bonding pad region; covering a protective layer over a top face of the second metal layer in the bonding pad region and over the first or second metal layer in an inner peripheral portion of the border region, which inner peripheral portion adjoins the bonding pad region; etching the first or second layer at least in an outer peripheral portion of the border region down to the top face of the functional layer; removing the protective layer; carrying out an etching process starting from the top face of the layered structure.