公开(公告)号：US09593012B2

公开(公告)日：2017-03-14

申请号：US14774799

申请日：2014-03-12

Applicant: Robert Bosch GmbH

Inventor： Friedjof Heuck ,  Christoph Schelling

IPC: B81C1/00

CPC classification number: B81C1/00619 ,  B81C1/00412 ,  B81C2201/0177 ,  B81C2201/0188

Abstract: A method for producing a micromechanical component includes providing a substrate with a monocrystalline starting layer which is exposed in structured regions. The structured regions have an upper face and lateral flanks, wherein a catalyst layer, which is suitable for promoting a silicon epitaxial growth of the exposed upper face of the structured monocrystalline starting layer, is provided on the upper face, and no catalyst layers are provided on the flanks. The method also includes carrying out a selective epitaxial growth process on the upper face of the monocrystalline starting layer using the catalyst layer in a reactive gas atmosphere in order to form a micromechanical functional layer.

Abstract translation: 微机械部件的制造方法包括向基板提供暴露在结构化区域中的单晶起始层。 结构化区域具有上表面和侧面，其中在上表面上设置适合于促进结构单晶起始层暴露的上表面的硅外延生长的催化剂层，并且不提供催化剂层 在侧面。 该方法还包括在反应气体气氛中使用催化剂层在单晶起始层的上表面上进行选择性外延生长工艺，以形成微机械功能层。

公开(公告)号：US20220231652A1

公开(公告)日：2022-07-21

申请号：US17647611

申请日：2022-01-11

Applicant: Robert Bosch GmbH

Inventor： Friedjof Heuck ,  Marcus Pritschow ,  Markus Kuhnke ,  Peter Schmollngruber ,  Ricardo Zamora ,  Sebastien Loiseau ,  Stefan Majoni ,  Stefan Krause ,  Viktor Morosow

IPC: H03H3/02 ,  H03H9/17 ,  H03H9/24

Abstract: A method for manufacturing a piezoelectric resonator. The method includes: depositing a piezoelectric layer and forming a recess in a lateral area in such a way that a silicon functional layer is exposed inside the recess, forming a silicide layer on a surface of the silicon functional layer exposed inside the recess, forming a diffusion barrier layer on the silicide layer, depositing and structuring a first and second metallization layer in such a way that a supply line and two connection elements are formed, forming the oscillating structure by structuring the silicon functional layer, the silicon functional layer of the oscillating structure being able to be electrically contacted via the first connection element and forming a lower electrode of the resonator, the first metallization layer of the oscillating structure being able to be electrically contacted via the second connection element and forming an upper electrode of the resonator.

公开(公告)号：US10753743B2

公开(公告)日：2020-08-25

申请号：US15775321

申请日：2016-11-10

Applicant: Robert Bosch GmbH

Inventor： Reinhard Neul ,  Torsten Ohms ,  Robert Maul ,  Mirko Hattass ,  Christian Hoeppner ,  Odd-Axel Pruetz ,  Benjamin Schmidt ,  Rolf Scheben ,  Friedjof Heuck

IPC: G01C19/5747 ,  G01C19/5712

Abstract: A micromechanical yaw rate sensor includes a substrate and a rotationally oscillating mass having a rotationally oscillating mass bearing. The rotationally oscillating mass bearing includes a rocker bar, a rocker spring rod which resiliently connects the rocker bar to the substrate, and two support spring rods which resiliently connect, on opposite sides of the rocker spring rod, the rocker bar to the rotationally oscillating mass.

公开(公告)号：US20170052364A1

公开(公告)日：2017-02-23

申请号：US15307433

申请日：2015-04-27

Applicant: Robert Bosch GmbH

Inventor： Frank Schatz ,  Friedjof Heuck ,  Kerrin Doessel ,  Stefan Pinter ,  Daniel Pantel ,  Franziska Rohlfing

IPC: G02B26/08 ,  G02B27/00 ,  G02B7/182

CPC classification number: G02B26/0833 ,  B81B7/0067 ,  B81B2201/042 ,  G02B7/1821 ,  G02B26/101 ,  G02B27/0006

Abstract: An assembly body for micromirror chips that partly encloses an internal cavity, the assembly body including at two sides oriented away from one another, at least one respective partial outer wall that is fashioned transparent for a specified spectrum, and the assembly body having at least one first outer opening on which a first micromirror chip can be attached, and a second outer opening on which a second micromirror chip can be attached, in such a way that a light beam passing through the first partial outer wall is capable of being deflected by the first micromirror chip onto the second micromirror chip, and is capable of being deflected by the second micromirror chip through the second partial outer wall. A mirror device and a production method for a mirror device are also described.

Abstract translation: 一种用于微镜芯片的组件主体，其部分地包围内部空腔，所述组件主体包括彼此远离的两个侧面，至少一个对于特定光谱为透明的相应部分外壁，并且所述组装体具有至少一个 可以安装有第一微反射镜芯片的第一外部开口和可以安装第二微反射镜芯片的第二外部开口，使得穿过第一部分外壁的光束能够被第一外部开口偏转 第一微镜芯片到第二微镜芯片上，并且能够被第二微镜芯片通过第二部分外壁偏转。 还描述了用于镜装置的镜装置和制造方法。

公开(公告)号：US20160023895A1

公开(公告)日：2016-01-28

申请号：US14774799

申请日：2014-03-12

Applicant: ROBERT BOSCH GMBH

Inventor： Friedjof Heuck ,  Christoph Schelling

IPC: B81C1/00

CPC classification number: B81C1/00619 ,  B81C1/00412 ,  B81C2201/0177 ,  B81C2201/0188

Abstract: A method for producing a micromechanical component includes providing a substrate with a monocrystalline starting layer which is exposed in structured regions. The structured regions have an upper face and lateral flanks, wherein a catalyst layer, which is suitable for promoting a silicon epitaxial growth of the exposed upper face of the structured monocrystalline starting layer, is provided on the upper face, and no catalyst layers are provided on the flanks. The method also includes carrying out a selective epitaxial growth process on the upper face of the monocrystalline starting layer using the catalyst layer in a reactive gas atmosphere in order to form a micromechanical functional layer.

Abstract translation: 微机械部件的制造方法包括向基板提供暴露在结构化区域中的单晶起始层。 结构化区域具有上表面和侧面，其中在上表面上设置适合于促进结构单晶起始层暴露的上表面的硅外延生长的催化剂层，并且不提供催化剂层 在侧面。 该方法还包括在反应气体气氛中使用催化剂层在单晶起始层的上表面上进行选择性外延生长工艺，以形成微机械功能层。

公开(公告)号：US20150340592A1

公开(公告)日：2015-11-26

申请号：US14759137

申请日：2014-01-10

Applicant: ROBERT BOSCH GMBH

Inventor： Tjalf Pirk ,  Andreas Krauss ,  Friedjof Heuck ,  Stefan Leidich ,  Christoph Schelling

IPC: H01L41/293 ,  H01L41/08 ,  H01L41/083 ,  H01L41/297

CPC classification number: H01L41/081 ,  H01L21/311 ,  H01L21/31116 ,  H01L41/0815 ,  H01L41/083 ,  H01L41/0831 ,  H01L41/27 ,  H01L41/293 ,  H01L41/297 ,  Y10T29/42 ,  Y10T29/43

Abstract: A method for producing a multi-layer electrode system includes providing a carrier substrate having a recess in a top side of the carrier substrate. At least one wall of the recess is inclined in relation to a bottom side of the carrier substrate, which is opposite to the top side. The method also includes applying a multi-layer stack, which includes at least a first electrode layer, a second electrode layer, and a piezoelectric layer arranged between the first electrode layer and the second electrode layer, to the top side of the carrier substrate. At least the wall and a bottom of the recess are covered by at least a portion of the multi-layer stack.

Abstract translation: 一种多层电极系统的制造方法，其特征在于，在所述载体基板的上侧设置具有凹部的载体基板。 凹部的至少一个壁相对于与顶侧相反的载体基板的底侧倾斜。 该方法还包括将至少包括第一电极层，第二电极层和布置在第一电极层和第二电极层之间的压电层的至少一层的多层堆叠施加到载体衬底的顶侧。 至少所述壁和所述凹部的底部被所述多层叠层的至少一部分覆盖。

公开(公告)号：US12160215B2

公开(公告)日：2024-12-03

申请号：US17647611

申请日：2022-01-11

Applicant: Robert Bosch GmbH

Inventor： Friedjof Heuck ,  Marcus Pritschow ,  Markus Kuhnke ,  Peter Schmollngruber ,  Ricardo Zamora ,  Sebastien Loiseau ,  Stefan Majoni ,  Stefan Krause ,  Viktor Morosow

IPC: H03H3/02 ,  H03H9/17 ,  H03H9/24

Abstract: A method for manufacturing a piezoelectric resonator. The method includes: depositing a piezoelectric layer and forming a recess in a lateral area in such a way that a silicon functional layer is exposed inside the recess, forming a silicide layer on a surface of the silicon functional layer exposed inside the recess, forming a diffusion barrier layer on the silicide layer, depositing and structuring a first and second metallization layer in such a way that a supply line and two connection elements are formed, forming the oscillating structure by structuring the silicon functional layer, the silicon functional layer of the oscillating structure being able to be electrically contacted via the first connection element and forming a lower electrode of the resonator, the first metallization layer of the oscillating structure being able to be electrically contacted via the second connection element and forming an upper electrode of the resonator.

公开(公告)号：US20210292160A1

公开(公告)日：2021-09-23

申请号：US17265451

申请日：2019-09-24

Applicant: Robert Bosch GmbH

Inventor： Friedjof Heuck ,  Jochen Tomaschko ,  Peter Schmollngruber ,  Thomas Friedrich ,  Volkmar Senz ,  Franziska Rohlfing

IPC: B81C1/00 ,  B81B7/00 ,  G01L9/00

Abstract: A method for producing a wafer connection between a first and a second wafer. The method includes providing a first and second material for forming a eutectic alloy, providing a first wafer having a receiving structure for a die structure, filling the receiving structure with the first material, providing a second wafer having a die structure, the second material being situated on the die structure, providing a stop structure on the first and/or second wafer, so that when the two wafers are joined, a defined stop is provided, heating the first and second material at least to the eutectic temperature of the eutectic alloy, joining the first and second wafer so that the die structure is at least partly introduced into the receiving structure, the stop structure, the receiving structure, the die structure.

公开(公告)号：US20210131897A1

公开(公告)日：2021-05-06

申请号：US16633266

申请日：2018-07-16

Applicant: Robert Bosch GmbH

Inventor： Friedjof Heuck ,  Mike Schwarz ,  Thomas Friedrich ,  Volkmar Senz

IPC: G01L9/00 ,  G01L19/06 ,  B81B3/00 ,  B81B7/00 ,  G01R27/26

Abstract: A micromechanical device that includes a carrier substrate; a sensor device that is situated on the carrier substrate and spaced apart from a surface section of the carrier substrate with the aid of spring elements in such a way that the sensor device is oscillatable relative to the surface section; and at least one stopper element, situated on the sensor device and/or on the surface section of the carrier substrate, which limits a deflection of the sensor device in the direction of the surface section.

公开(公告)号：US10012828B2

公开(公告)日：2018-07-03

申请号：US15307433

申请日：2015-04-27

Applicant: Robert Bosch GmbH

Inventor： Frank Schatz ,  Friedjof Heuck ,  Kerrin Doessel ,  Stefan Pinter ,  Daniel Pantel ,  Franziska Rohlfing

IPC: G02B7/182 ,  G02B26/08 ,  B81B7/00 ,  G02B27/00 ,  G02B26/10

CPC classification number: G02B26/0833 ,  B81B7/0067 ,  B81B2201/042 ,  G02B7/1821 ,  G02B26/101 ,  G02B27/0006

Abstract: An assembly body for micromirror chips that partly encloses an internal cavity, the assembly body including at two sides oriented away from one another, at least one respective partial outer wall that is fashioned transparent for a specified spectrum, and the assembly body having at least one first outer opening on which a first micromirror chip can be attached, and a second outer opening on which a second micromirror chip can be attached, in such a way that a light beam passing through the first partial outer wall is capable of being deflected by the first micromirror chip onto the second micromirror chip, and is capable of being deflected by the second micromirror chip through the second partial outer wall. A mirror device and a production method for a mirror device are also described.