公开(公告)号：US20210084765A1

公开(公告)日：2021-03-18

申请号：US16477477

申请日：2017-12-07

Applicant: Robert Bosch GmbH

Inventor： Udo Kaess ,  Uwe Liskow ,  Markus Weiss

IPC: H05K1/14

Abstract: A method for mechanically connecting a first electronic component, in particular a circuit board element, to a second electronic component, in particular a second circuit board element, includes arranging and orienting the first electronic component, which includes a first through-opening in a first direction, above the second electronic component in the first direction in such a way that a second through opening in the first direction or a blind hole in the first direction is arranged at least partially below the first through-opening in the first direction. The method further includes introducing a casting compound into the first through-opening and into the second through-opening or into the first through-opening and into the blind hole, and setting the casting compound in order to fix the first electronic component in relation to the second electronic component.