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公开(公告)号：US11343920B2
公开(公告)日：2022-05-24
申请号：US16603470
申请日：2018-03-21
Applicant: Robert Bosch GmbH
Inventor： Udo Kaess , Uwe Katzenwadel , Peter Weiberle
Abstract: A method for producing an electronic sensor module includes applying first soldering material onto electrical soldering pads of a printed circuit board element and/or electrical soldering pads of a printed circuit board element contact side of a sensor carrier, arranging the sensor carrier with the electrical soldering pads of the printed circuit board element contact side on the electrical soldering pads of the printed circuit board element to produce electrical connections between connecting lines and the printed circuit board element, applying second soldering material onto electrical connecting elements of a sensor element and/or soldering pads of the sensor receptacle, arranging the sensor element in the sensor receptacle such that the second soldering material produces electrical connections between the electrical connecting elements of the sensor element and the soldering pads of the sensor receptacle, and reflow-soldering the first soldering material and the second soldering material in a joint reflow-soldering process.
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公开(公告)号：US20160231198A1
公开(公告)日：2016-08-11
申请号：US15029754
申请日：2014-08-26
Applicant: ROBERT BOSCH GMBH
Inventor： Udo Kaess , Thorsten Droigk , Peter Weiberle , Olivier Kukawka
CPC classification number: G01M13/022 , F16D11/14 , F16D2011/008 , F16D2300/18 , G01D5/142 , G01D5/16 , G01D5/20 , G01D5/26 , G01S13/88
Abstract: A clutch sensor system includes a clutch part that is rotatable about and axially displaceable along an axis of rotation, and a sensor device having at least one sensor element configured to detect a rotary movement parameter of the clutch part. A circumferential transmitter structure is disposed on a circumference of the clutch part, and has a first sub-structure and at least one second sub-structure that follow each other in alternating fashion in a circumferential direction. The sub-structures are separated by structure transitions that move past a detection area of the sensor element as the clutch part rotates, whereby the sensor device generates a sensor signal that includes information about the rotary movement parameter. A circumferential distance between successive structure transitions depends on an axial displacement of the clutch part, such that the sensor signal also includes information about the axial displacement position of the clutch part.
Abstract translation: 离合器传感器系统包括可沿着旋转轴线旋转并可轴向移动的离合器部件，以及传感器装置，其具有被配置为检测离合器部件的旋转运动参数的至少一个传感器元件。 周向发送器结构设置在离合器部分的圆周上，并且具有第一子结构和至少一个第二子结构，其沿圆周方向交替地相互依次。 当离合器部分旋转时，子结构通过结构转变分离，移动通过传感器元件的检测区域，由此传感器装置产生包括关于旋转运动参数的信息的传感器信号。 连续结构转变之间的圆周距离取决于离合器部分的轴向位移，使得传感器信号还包括关于离合器部分的轴向位移位置的信息。
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公开(公告)号：US20210127498A1
公开(公告)日：2021-04-29
申请号：US16603470
申请日：2018-03-21
Applicant: Robert Bosch GmbH
Inventor： Udo Kaess , Uwe Katzenwadel , Peter Weiberle
Abstract: A method for producing an electronic sensor module includes applying first soldering material onto electrical soldering pads of a printed circuit board element and/or electrical soldering pads of a printed circuit board element contact side of a sensor carrier, arranging the sensor carrier with the electrical soldering pads of the printed circuit board element contact side on the electrical soldering pads of the printed circuit board element to produce electrical connections between connecting lines and the printed circuit board element, applying second soldering material onto electrical connecting elements of a sensor element and/or soldering pads of the sensor receptacle, arranging the sensor element in the sensor receptacle such that the second soldering material produces electrical connections between the electrical connecting elements of the sensor element and the soldering pads of the sensor receptacle, and reflow-soldering the first soldering material and the second soldering material in a joint reflow-soldering process.
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公开(公告)号：US20210084765A1
公开(公告)日：2021-03-18
申请号：US16477477
申请日：2017-12-07
Applicant: Robert Bosch GmbH
Inventor： Udo Kaess , Uwe Liskow , Markus Weiss
IPC: H05K1/14
Abstract: A method for mechanically connecting a first electronic component, in particular a circuit board element, to a second electronic component, in particular a second circuit board element, includes arranging and orienting the first electronic component, which includes a first through-opening in a first direction, above the second electronic component in the first direction in such a way that a second through opening in the first direction or a blind hole in the first direction is arranged at least partially below the first through-opening in the first direction. The method further includes introducing a casting compound into the first through-opening and into the second through-opening or into the first through-opening and into the blind hole, and setting the casting compound in order to fix the first electronic component in relation to the second electronic component.
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