公开(公告)号：US10607888B2

公开(公告)日：2020-03-31

申请号：US16475755

申请日：2018-04-06

Applicant: Robert Bosch GmbH

Inventor： Christoph Schelling ,  Johannes Classen ,  Simon Genter

IPC: H01L21/768 ,  H01L23/48 ,  H01L23/00

Abstract: A conductive through-plating for a substrate includes a metal component, a first conductive structure situated on or in the environment of a surface of the substrate, and a second conductive structure situated on or in the environment of a further surface of the substrate. A method for producing the through-plating includes, in a first step, at least partially applying above the surface a grid structure that includes a group of openings; in a second step following the first step, carrying out an etching producing a trench in the substrate and at least partially also underneath the group of openings; and, in a fifth step following the second step, carrying out a metallization situating a metal component at least partially in the trench such that the metal component is part of a seal sealing the trench in the area of the surface.