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公开(公告)号：US20240182298A1
公开(公告)日：2024-06-06
申请号：US18525410
申请日：2023-11-30
申请人： Robert Bosch GmbH
发明人： Johannes Classen
IPC分类号： B81C1/00
CPC分类号： B81C1/00619 , B81C2201/0116 , B81C2201/0132 , B81C2201/0198 , B81C2203/035 , B81C2203/0785
摘要： A method producing a microelectromechanical component. A dielectric layer is structured on an upper side of a substrate forming a grating, and a blind hole is formed beneath the grating. A cover layer is arranged on the dielectric layer closing the blind hole. A layer sequence is arranged on the cover layer and above the blind hole. Functional structures are formed in the layer sequence and an access channel extending through the layer sequence to the blind hole is formed. A further substrate is connected to the substrate. The functional structures are enclosed in a cavity, connected to the blind hole, between the substrate and the further substrate. Another blind hole is formed on an underside of the substrate. The blind hole is opened in the region of the other blind hole. A cavity internal pressure is set, and the blind hole is closed.
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公开(公告)号：US11860184B2
公开(公告)日：2024-01-02
申请号：US17447876
申请日：2021-09-16
申请人： Robert Bosch GmbH
发明人： Cristian Nagel , Johannes Classen , Lars Tebje , Rolf Scheben , Rudy Eid
IPC分类号： G01P15/08 , G01P15/125 , B81B3/00
CPC分类号： G01P15/0802 , B81B3/001 , B81B3/0051 , G01P15/125 , B81B2201/0235 , B81B2203/0163 , B81B2203/04 , G01P2015/0831 , G01P2015/0862 , G01P2015/0871
摘要： A micromechanical structure including a substrate, a moveable seismic mass, a detection structure, and a main spring. The seismic mass is connected to the substrate using the main spring. A first direction and a second direction perpendicular thereto define a main extension plane of the substrate. The detection structure detects a deflection of the seismic mass and includes first electrodes mounted at the seismic mass and second electrodes mounted at the substrate. The first electrodes and second electrodes have a two-dimensional extension in the first and second directions. The micromechanical structure has a graduated stop structure including a first spring stop, a second spring stop, and a fixed stop.
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公开(公告)号：US11768221B2
公开(公告)日：2023-09-26
申请号：US17447764
申请日：2021-09-15
申请人： Robert Bosch GmbH
CPC分类号： G01P15/18 , B81B7/02 , B81B2201/0235 , B81B2207/03
摘要： A micromechanical sensor, including a micromechanical chip having a first micromechanical structure, a first evaluation chip, having a first application-specific integrated circuit, and a second evaluation chip having a second application-specific integrated circuit. The first evaluation chip and the micromechanical chip are situated in a stacked manner, the micromechanical chip being directly electrically conductively connected with the first evaluation chip and the first evaluation chip being directly electrically conductively connected with the second evaluation chip. The first application-specific integrated circuit primarily includes analog circuit elements and the second application-specific circuit primarily includes digital circuit elements.
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公开(公告)号：US11623861B2
公开(公告)日：2023-04-11
申请号：US17169250
申请日：2021-02-05
申请人： Robert Bosch GmbH
发明人： Johannes Classen
摘要： A micromechanical component for a sensor device including a substrate having a substrate surface, at least one stator electrode situated on the substrate surface and/or on the at least one intermediate layer covering at least partially the substrate surface, which is formed in each case from a first semiconductor and/or metal layer, at least one adjustably situated actuator electrode, which is formed in each case from a second semiconductor and/or metal layer, and a diaphragm spanning the at least one stator electrode and the at least one actuator electrode, including a diaphragm exterior side directed away from the at least one stator electrode, which is formed from a third semiconductor and/or metal layer, a stiffening and/or protective structure protruding at the diaphragm exterior side being formed from a fourth semiconductor and/or metal layer.
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公开(公告)号：US11619647B2
公开(公告)日：2023-04-04
申请号：US17236662
申请日：2021-04-21
申请人： Robert Bosch GmbH
发明人： Johannes Classen
IPC分类号： G01P15/00 , G01P15/125 , G01P15/08
摘要： A micromechanical sensor system, in particular, an acceleration sensor, including a substrate having a main extension plane, the sensor system including a first mass and a second mass. The first and second masses are each designed to be at least partially movable in a vertical direction, perpendicular to the main extension plane of the substrate. The first mass includes a stop structure, wherein the stop structure has an overlap with the second mass in the vertical direction.
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公开(公告)号：US20210325422A1
公开(公告)日：2021-10-21
申请号：US17221362
申请日：2021-04-02
申请人： Robert Bosch GmbH
发明人： Amin Jemili , Joerg Braeuer , Johannes Classen
摘要： A sensor system including a plurality of individual and separate sensor elements. Each of the individual sensor elements is independently functional. The individual sensor elements of the sensor system being formed in one piece from parts of a wafer or a vertically integrated wafer stack. The sensor system including at least one separation structure, in particular a scribe line, between the individual and separate sensor elements.
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公开(公告)号：US11111137B2
公开(公告)日：2021-09-07
申请号：US16323133
申请日：2017-07-05
申请人： Robert Bosch GmbH
发明人： Johannes Classen
摘要： A method for manufacturing a micromechanical sensor, including the steps: providing a MEMS wafer that includes a MEMS substrate, a defined number of etching trenches being formed in the MEMS substrate in a diaphragm area, the diaphragm area being formed in a first silicon layer that is situated at a defined distance from the MEMS substrate; providing a cap wafer; bonding the MEMS wafer to the cap wafer; and forming a media access point to the diaphragm area by grinding the MEMS substrate.
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公开(公告)号：US20200180947A1
公开(公告)日：2020-06-11
申请号：US16700391
申请日：2019-12-02
申请人： Robert Bosch GmbH
发明人： Johannes Classen
摘要： A method for setting a pressure in a cavern formed using a substrate and a substrate cap, the cavern being part of a semiconductor system, including an additional cavern formed with using the substrate and of the substrate cap, a microelectromechanical system being situated in the cavern, an additional microelectromechanical system being situated in the additional cavern, a diffusion area being situated in the substrate and/or in the substrate cap, the method includes a gas diffusing with the aid of the diffusion area from the surroundings into the cavern, during the diffusing, a diffusivity and/or a diffusion flow of the gas from the surroundings into the cavern being greater than an additional diffusivity and/or an additional diffusion flow of the gas from the surroundings into the additional cavern, and/or during the diffusing, the additional cavern being at least essentially protected from a penetration of the gas into the additional cavern.
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公开(公告)号：US20200156930A1
公开(公告)日：2020-05-21
申请号：US16681124
申请日：2019-11-12
申请人： Robert Bosch GmbH
发明人： Johannes Classen , Laszlo Gogh
IPC分类号： B81B5/00 , G01P15/08 , G01P15/125 , B81B3/00 , G01C19/5747
摘要： A micromechanical component having a movable seismic mass developed in a second and third silicon functional layer, a hollow body being developed in the second and third silicon functional layers, which has a cover element developed in a fourth silicon functional layer.
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公开(公告)号：US10215772B2
公开(公告)日：2019-02-26
申请号：US15119010
申请日：2014-12-22
申请人： Robert Bosch GmbH
发明人： Johannes Classen
IPC分类号： G01P15/125 , G01P15/08
摘要： A micromechanical structure for an acceleration sensor, including a seismic mass that is constituted definedly asymmetrically with reference to the rotational Z axis of the structure of the acceleration sensor, spring elements that are fastened on the seismic mass and on at least one fastening element, a rotational motion of the seismic mass being generatable by way of the spring elements substantially only upon an acceleration in a defined sensing direction within a plane constituted substantially orthogonally to the rotational Z axis.
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