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公开(公告)号：US07604486B2
公开(公告)日：2009-10-20
申请号：US11614885
申请日：2006-12-21
IPC分类号： H01R12/00
CPC分类号： H05K7/1069
摘要： Apparatus including a body as an intermediary between a device and a printed circuit board, the body including a contact area defined by a plurality of openings each to accommodate a contact therethrough and an alignment feature adjacent the contact area and protruding from a plane defined by the contact area, wherein a surface of the alignment feature includes a friction-reducing material. A method including contacting an alignment feature of a socket with a friction-reducing material. Apparatus and system including a body as an intermediary between a device and a printed circuit board; a plurality of contacts each disposed through a contact area of the body and oriented to deflect a device in a first direction; and a load plate coupled to the body and configured to apply an actuation force on a device in a different second direction. A method including inserting a device into a socket.
摘要翻译： 一种设备，包括作为设备和印刷电路板之间的介质的主体，所述主体包括由多个开口限定的接触区域，每个开口各自容纳穿过其中的接触件，以及邻近所述接触区域并从由所述接触区域限定的平面突出的对准部件 接触区域，其中对准特征的表面包括减摩材料。 一种方法，包括使插座的对准特征与减摩材料接触。 装置和系统包括作为装置和印刷电路板之间的介质的主体; 多个触点，每个触头均设置成穿过主体的接触区域并且被定向成沿第一方向偏转装置; 以及联接到所述主体并且被配置成在不同的第二方向上对设备施加致动力的负载板。 一种方法，包括将设备插入插座。
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公开(公告)号：US20080151511A1
公开(公告)日：2008-06-26
申请号：US11614885
申请日：2006-12-21
CPC分类号： H05K7/1069
摘要： Apparatus including a body as an intermediary between a device and a printed circuit board, the body including a contact area defined by a plurality of openings each to accommodate a contact therethrough and an alignment feature adjacent the contact area and protruding from a plane defined by the contact area, wherein a surface of the alignment feature includes a friction-reducing material. A method including contacting an alignment feature of a socket with a friction-reducing material. Apparatus and system including a body as an intermediary between a device and a printed circuit board; a plurality of contacts each disposed through a contact area of the body and oriented to deflect a device in a first direction; and a load plate coupled to the body and configured to apply an actuation force on a device in a different second direction. A method including inserting a device into a socket.
摘要翻译： 设备包括作为设备和印刷电路板之间的介质的主体，所述主体包括由多个开口限定的接触区域，每个开口各自容纳穿过其中的接触件，以及邻近所述接触区域并从由所述接触区域限定的平面突出的对准部件 接触区域，其中对准特征的表面包括减摩材料。 一种方法，包括使插座的对准特征与减摩材料接触。 装置和系统包括作为装置和印刷电路板之间的介质的主体; 多个触点，每个触头均设置成穿过主体的接触区域并且被定向成沿第一方向偏转装置; 以及联接到所述主体并且被配置成在不同的第二方向上对设备施加致动力的负载板。 一种方法，包括将设备插入插座。
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3.发明申请SINGLE LOADING MECHANISM TO APPLY FORCE TO BOTH COOLING APPARATUS AND INTEGRATED CIRCUIT PACKAGE 有权单一装载机械应用于冷却装置和集成电路封装公开(公告)号：US20070297143A1
公开(公告)日：2007-12-27
申请号：US11426929
申请日：2006-06-27
申请人： Robert R. Martinson , Alin Ila , Mandy Mistkawi
发明人： Robert R. Martinson , Alin Ila , Mandy Mistkawi
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of the invention provide single loading mechanism that both pushes a semiconductor package against a socket and pushes a cooling solution against the semiconductor package. This loading mechanism may take up less motherboard real estate than if two different attachment and loading mechanisms were used.
摘要翻译： 本发明的实施例提供单一加载机构，其将半导体封装推到插座上并将冷却溶液推向半导体封装。 如果使用两种不同的附件和加载机制，这种加载机制可能占用较少的主板空间。
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4.发明授权Single loading mechanism to apply force to both cooling apparatus and integrated circuit package 有权单一加载机构对两个冷却装置和集成电路封装施加力公开(公告)号：US07427210B2
公开(公告)日：2008-09-23
申请号：US11426929
申请日：2006-06-27
申请人： Robert R. Martinson , Alin Ila , Mandy Mistkawi
发明人： Robert R. Martinson , Alin Ila , Mandy Mistkawi
IPC分类号： H01R13/00
CPC分类号： H01L23/427 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of the invention provide single loading mechanism that both pushes a semiconductor package against a socket and pushes a cooling solution against the semiconductor package. This loading mechanism may take up less motherboard real estate than if two different attachment and loading mechanisms were used.
摘要翻译： 本发明的实施例提供单一加载机构，其将半导体封装推到插座上并将冷却溶液推向半导体封装。 如果使用两种不同的附件和加载机制，这种加载机制可能占用较少的主板空间。
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