公开(公告)号：US20070297143A1

公开(公告)日：2007-12-27

申请号：US11426929

申请日：2006-06-27

申请人： Robert R. Martinson ,  Alin Ila ,  Mandy Mistkawi

发明人： Robert R. Martinson ,  Alin Ila ,  Mandy Mistkawi

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： Embodiments of the invention provide single loading mechanism that both pushes a semiconductor package against a socket and pushes a cooling solution against the semiconductor package. This loading mechanism may take up less motherboard real estate than if two different attachment and loading mechanisms were used.

摘要翻译： 本发明的实施例提供单一加载机构，其将半导体封装推到插座上并将冷却溶液推向半导体封装。 如果使用两种不同的附件和加载机制，这种加载机制可能占用较少的主板空间。

公开(公告)号：US07455526B1

公开(公告)日：2008-11-25

申请号：US11863810

申请日：2007-09-28

申请人： Alin Ila ,  Mehdi Imaninejad ,  Xiaoqing Ma

发明人： Alin Ila ,  Mehdi Imaninejad ,  Xiaoqing Ma

IPC分类号： H01R13/60

CPC分类号： H05K7/1061 ,  Y10S439/94

摘要： Disclosed is an electrical connector assembly. The electrical connector assembly comprises a land grid array socket and the pick-and-placed (PnP) cap. The land grid array socket comprises a socket body and a loading mechanism. The PnP cap is removably attached to the peripheral edge of the socket body for covering a first surface of the socket body. The loading mechanism comprising a loading plate is mounted over the socket body and the PnP cap. The PnP cap detachably engages the loading plate, when the loading plate is mounted over the PnP cap.

摘要翻译： 公开了一种电连接器组件。 电连接器组件包括平台栅格阵列插座和拾取放置（PnP）盖。 地面阵列插座包括插座主体和装载机构。 PnP盖可移除地附接到插座主体的周边边缘，用于覆盖插座主体的第一表面。 包括装载板的装载机构安装在插座主体和PnP盖上。 当装载板安装在PnP盖上时，PnP盖可拆卸地接合装载板。

公开(公告)号：US20080218972A1

公开(公告)日：2008-09-11

申请号：US11714333

申请日：2007-03-06

申请人： Ioan Sauciuc ,  Seri Lee ,  Alin Ila ,  Steven Girouard ,  Javier Leija ,  Behre Mulugeta

发明人： Ioan Sauciuc ,  Seri Lee ,  Alin Ila ,  Steven Girouard ,  Javier Leija ,  Behre Mulugeta

IPC分类号： H05K7/20 ,  F28F13/00

CPC分类号： F04D33/00 ,  F04D29/582 ,  F28F3/02 ,  F28F13/10 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20172 ,  H01L2924/00

摘要： A cooling device includes a heat sink (110) having a plurality of fins (111) and a piezoelectric assembly (120) having an actuator (121) and a plurality of blades (122) coupled to the actuator. The actuator includes a plurality of metal electrodes (227) and a plurality of piezoelectric layers (228). The fins of the heat sink are intertwined with the blades of the piezoelectric assembly.

摘要翻译： 冷却装置包括具有多个翅片（111）和具有致动器（121）的压电组件（120）和耦合到致动器的多个叶片（122）的散热器（110）。 致动器包括多个金属电极（227）和多个压电层（228）。 散热片的翅片与压电组件的叶片相互缠绕。

公开(公告)号：US07427210B2

公开(公告)日：2008-09-23

申请号：US11426929

申请日：2006-06-27

申请人： Robert R. Martinson ,  Alin Ila ,  Mandy Mistkawi

发明人： Robert R. Martinson ,  Alin Ila ,  Mandy Mistkawi

IPC分类号： H01R13/00

CPC分类号： H01L23/427 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： Embodiments of the invention provide single loading mechanism that both pushes a semiconductor package against a socket and pushes a cooling solution against the semiconductor package. This loading mechanism may take up less motherboard real estate than if two different attachment and loading mechanisms were used.

摘要翻译： 本发明的实施例提供单一加载机构，其将半导体封装推到插座上并将冷却溶液推向半导体封装。 如果使用两种不同的附件和加载机制，这种加载机制可能占用较少的主板空间。

公开(公告)号：US06988871B2

公开(公告)日：2006-01-24

申请号：US10402700

申请日：2003-03-31

申请人： Steven Deboer ,  Alin Ila ,  Kevin O'Neill ,  Ross Armstrong

发明人： Steven Deboer ,  Alin Ila ,  Kevin O'Neill ,  Ross Armstrong

IPC分类号： F01D11/00

CPC分类号： H01L23/4093 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T24/308 ,  Y10T24/44026 ,  H01L2924/00

摘要： A heat sink attachment clip for attaching a heat sink assembly to a frame, the heat sink attachment clip includes a pair of attachment brackets. Each attachment bracket has one or more attachment legs and each attachment leg has a clip attachment means for engagement with a corresponding frame attachment means. A levered cam is used to bear on heat sink assembly. The levered cam is moveable from a first position in which the levered cam does not press the heat sink assembly against the frame to a second position in which the levered cam the heat sink assembly presses the heat sink assembly against the frame. A a handle connects the levered cams of the two attachment clips so that movement of the handle engages both levered cams simultaneously.

公开(公告)号：US20050133198A1

公开(公告)日：2005-06-23

申请号：US10926013

申请日：2004-08-26

申请人： Ross Armstrong ,  Alin Ila ,  Victor Kheil

发明人： Ross Armstrong ,  Alin Ila ,  Victor Kheil

IPC分类号： B23K1/00 ,  B23K35/14 ,  B23K35/26 ,  H05K7/20

CPC分类号： B23K1/0012 ,  B23K1/0016 ,  B23K35/262 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/18 ,  Y10T29/4935 ,  Y10T29/5313

摘要： A folded fin heat sink assembly and a method of fabricating a folded fin heat sink assembly for use as a cooling solution in micro-electronics and/or telecommunication applications. The heat sink assembly is formed by placing a sheet or paste of Sn—Zn solder upon a copper base plate, placing one or more aluminum folded fin assemblies on the solder sheet or paste, heating the base plate, the folded fin assembly and the solder to a temperature exceeding the liquidus temperature of the solder and allowing the solder to flow, and cooling the solder to form a soldered joint between the base plate and the folded fin assembly.

摘要翻译： 折叠翅片散热器组件和制造用于微电子和/或电信应用中的冷却解决方案的折叠散热片散热器组件的方法。 散热器组件通过将Sn-Zn焊料的片或糊料放置在铜基板上，将一个或多个铝折叠翅片组件放置在焊料片或糊料上，加热底板，折叠翅片组件和焊料 超过焊料的液相线温度并允许焊料流动，并且冷却焊料以在基板和折叠翅片组件之间形成焊接接头。